tag: PDF Solutions

Wafer Probe Struggles To Adapt To Multi-Die Assemblies
By Gregory Haley - 13 Jan, 2026 - Comments: 1

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the semiconductor industry’s history, wafer probe occupied a stable, largely uncontested role in manufacturing. It was understood as a screening step, an electrical checkpoint to identify failing de... » read more

Semiconductor Manufacturing In The AI Era
By Christophe Begue - 13 Jan, 2026 - Comments: 0

At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the semiconductor industry at a pivotal inflection point, one driven by explosive AI demand but constrained by unprecedented manufacturing complexity. His central message: the path to a trillion-dollar semiconductor industry by 2030 requires fundamentally rethinking how manufacturers c... » read more

Secure Data Sharing Becoming Critical For Chip Manufacturing
By Laura Peters - 13 Jan, 2026 - Comments: 0

Semiconductor companies increasingly need to share data to solve problems faster, boost yield, and trace the root cause of failed devices. But to make that work, companies need assurances that their data will be secure, free from data leaks that could result in the loss of valuable IP. Data sharing is becoming critical at leading device nodes, where process variability is starting to consume... » read more

Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms
By PDF Solutions - 13 Jan, 2026 - Comments: 0

Demand for advanced computing is robust, driven by AI, cloud technologies, and widespread electrification of the economy. As Moore’s Law slows, the industry is pivoting toward innovative approaches—exploring 3D architectures, chiplets, and sophisticated hybrid packages. Concurrently, the semiconductor landscape is becoming increasingly global, with advanced devices now relying on integratin... » read more

Tracing The Equipment Connectivity Journey
By Bob Reback - 09 Dec, 2025 - Comments: 0

The semiconductor industry has undergone a dramatic transformation from the early days of manual integration to today's AI-driven collaboration with equipment connectivity at the heart of this evolution. Understanding these trends is crucial for any organization looking to leverage data for improved efficiency, reliability, and competitive advantage. This blog explores milestones and emergin... » read more

Adaptive Test Gaining Ground For HPC And AI Chips
By Gregory Haley - 09 Dec, 2025 - Comments: 0

Adaptive test is starting to gain traction for high-performance computing and AI chips as test programs that rely on static limits and fixed test sequences reach their practical limits. The growing complexity of multi-die assemblies and power delivery, along with increased stresses, are forcing a shift toward real-time, data-driven optimization at the test cell. “It’s the same old pro... » read more

Metrology Digs Deep To Produce Next-Generation 3D NAND
By Laura Peters - 09 Dec, 2025 - Comments: 1

Each generation of 3D NAND packs about 30% more bits than the previous version, with current devices storing up to 2 terabits of data in a die the size of a fingernail. With new product introductions shrinking from 18 months to every 12 months, chipmakers are constantly innovating to enable this prodigious scaling pace. 3D NAND technology is a core ingredient in mobile phones, solid-state dr... » read more

Zero-Trust Data Sharing Architectures Redefining Chip Manufacturing
By Anne Meixner - 09 Dec, 2025 - Comments: 0

Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins... » read more

The Growing Need For Collaboration Across The Semiconductor Industry
By PDF Solutions - 09 Dec, 2025 - Comments: 0

Abstract: AI-driven collaboration is becoming essential for the semiconductor industry to manage its increasingly complex global supply chain. This new model facilitates real-time data sharing and multi-party orchestration, moving beyond conventional, crisis-driven interactions. By leveraging a secure data infrastructure, automated orchestration, and AI agents, companies can automate busines... » read more

AI-Driven Collaboration In Chip Manufacturing
By Ed Sperling - 24 Nov, 2025 - Comments: 0

3D chips and multi-die assemblies can offer significant improvements in performance and power, but the tradeoff is the increased amount of time and money it takes to generate working silicon. There are more process steps, more interactions between processes, and more data to manage throughout the manufacturing flow — so much, in fact, that it has now reached well beyond what even the best eng... » read more

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