tag: Quadric

Balancing Training, Quantization, And Hardware Integration In NPUs
By Ann Mutschler - 26 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML is driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down to discuss this with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Qu... » read more

Addressing Critical Tradeoffs In NPU Design
By Ann Mutschler - 21 Jan, 2026 - Comments: 1

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven W... » read more

Chip Industry Week in Review
By The SE Staff - 16 Jan, 2026 - Comments: 0

Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

How And Why To Optimize NPUs
By Ann Mutschler - 15 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones.  Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven... » read more

Annual Global IC Fabs And Facilities Report
By Liz Allan - 07 Jan, 2026 - Comments: 0

Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Programmable Chips Evolve For Shifting Needs
By Liz Allan - 23 Dec, 2025 - Comments: 0

ICs and SoCs are utilizing a range of processing elements that allow them to optimize current workloads while hedging their bets for the future. What used to be a simple choice between an ASIC, FPGA, or DSP, has evolved into a mix of processor types and architectures, including varying levels of programmability and customization. Speed is essential, but technology is evolving so quickly that... » read more

AI Moves Out Of The Cloud And Onto The Edge
By Lee Vick - 11 Dec, 2025 - Comments: 0

The impact of AI to date, in the cloud, is undisputed, but the question we must answer going forward is whether we can only expect more of the same or whether there is a fundamental shift looming that will change everything. Today, we will explore historical data to find patterns repeated through the ages to help us see what I will attempt to prove is imminent. A brief history of time… keepi... » read more

AI Buildout Makes HPC Simulation More Challenging
By Ann Mutschler - 11 Dec, 2025 - Comments: 0

Simulations of semiconductors and systems are becoming bigger, more complex, and increasingly necessary, mirroring everything that is happening to the hardware itself — particularly in AI data centers. The move beyond monolithic chips to multi-die assemblies now requires solving some thorny multi-physics challenges, such as thermal and power delivery, which are increasingly difficult to mo... » read more

Chiplets Vs. Soft IP: Different In Almost Every Way
By Bryon Moyer - 11 Dec, 2025 - Comments: 2

Chiplets serve a similar function as the soft IP widely used in chips today, but the similarities end there. While both can speed time to market and enable design teams to focus limited resources where they can best be applied, the implementation, manufacturing, test, and long-term business requirements wrought by a chiplet marketplace would be very different. Soft IP (also known as RTL IP) ... » read more

Overflowing Zoo: The Power Of Compilers
By Steve Roddy - 16 Oct, 2025 - Comments: 0

The term “model zoo” first gained prominence in the world of Artificial Intelligence/Machine Learning (AI/ML) beginning in the 2016-2017 timeframe. Originally used to describe open-source public repositories of working AI models — the most prominent of which today is Hugging Face — the term has since been adopted by nearly all vendors of AI chips and licensable Neural Processors Units (... » read more

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