tag: Rambus

The Week In Review: IoT
By Jeff Dorsch - 12 Aug, 2016 - Comments: 0

Deals Rambus completed its $32 million acquisition of the Snowbush IP assets from Semtech. Through the end of 2022, Rambus may make additional payments on the transaction, depending upon new product sales. The Snowbush IP assets became part of the Memory and Interfaces Division at Rambus, complementing the company’s offerings in IP and serializer/deserializer blocks. Samsung Electronics A... » read more

Blog Review: Aug. 10
By Jesse Allen - 10 Aug, 2016 - Comments: 0

Is the end near for FinFETs? Applied's Mike Chudzik digs into the impact of rising parasitic resistance and parasitic capacitance and the challenges of scaling to 5nm. Cadence's Paul McLellan checks out the method UC Berkeley is using to build RISC-V processors. Mentor's Colin Walls warns that in C even the simplest things, like the declaration of variables, have pitfalls for the unwary. ... » read more

Is Security A Priority?
By Ed Sperling - 10 Aug, 2016 - Comments: 0

Ask any two executives in the semiconductor industry about security threats and there is a good chance you will get two totally different answers. The disturbing part is they both may be right. In markets where there is no physical danger to people, security always has been viewed a risk versus profit equation. At conferences over the past year, numerous executives have touted the Transport... » read more

The Week in Review: IoT
By Jeff Dorsch - 05 Aug, 2016 - Comments: 0

Deals Rambus finalized its acquisition of the memory interconnect business at Inphi. The closing price was $90 million in cash. The former Inphi business became part of the Memory and Interfaces Division at Rambus. CyberX raised $9 million of private funding in a financing round led by Flint Capital. Glilot Capital Partners, Swarth Group, and GlenRock, all existing investors, were joined by... » read more

The Week In Review: Design
By Jesse Allen - 05 Aug, 2016 - Comments: 0

Tools ProPlus Design Solutions unveiled its 9812DX wafer-level 1/f noise characterization system, an enhanced version of its de facto standard 9812D. It includes a more than 10X increase in system resolution, as well as a speedup boost three-to-five times faster than previous systems, higher voltage support up to 200V, and lower current support down to 0.1nA. It also adds a wider range of me... » read more

Designing Automotive Security For Connected Vehicles
By Asaf Ashkenazi - 04 Aug, 2016 - Comments: 0

The general concept of basic automotive security has been around for a number of years. Nevertheless, its scale and scope is rapidly evolving, with new classes of vulnerabilities brought to the fore as more and more electronic systems go online. Put simply, the automotive industry is connecting systems that weren’t originally designed to be part of the rapidly burgeoning Internet of Things (I... » read more

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2016 - Comments: 0

Mentor's Andrew Macleod presents three hours of highlights from this year's IESF automotive conference in Detroit with topics from making cars more affordable to reaching an efficiency of 54.5 MPG. Cadence's Paul McLellan checks out the state of the smartphone landscape now that consolidation in the market seems to be complete at the Linley Mobile Conference. Synopsys' Eric Huang consider... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

The Week In Review: Design
By Jesse Allen - 29 Jul, 2016 - Comments: 0

IP Rambus debuted 3200 Mbps DDR4 PHY, targeted at the data center and networking markets, on the GlobalFoundries FX-14 ASIC platform using the company's 14nm Power Plus (LPP) process. The PHY is DFI 4.0 compatible, and supports 16 – 72-bit interfaces, along with single and multi-rank configurations. Synopsys introduced VIP and UVM source code test suite for Ethernet 200G, supporting 4x5... » read more

Blog Review: July 27
By Jesse Allen - 27 Jul, 2016 - Comments: 0

Mentor's Tom Fitzpatrick investigates how to add new behavior to an existing testbench with the UVM factory class. Synopsys' Srinivas Vijayaragavan and Pooja Gupta dig into new features of SAS 24G, including how its effective speed was doubled to 24G though signaling rate remains at 22.5G. Cadence's Paul McLellan highlights a presentation from the SEMI/Gartner Market Symposium focused on ... » read more

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