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Mask/Lithography Issues For Mature Nodes


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. ... » read more

DSA Re-Enters Litho Picture


By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

Why EUV Is So Difficult


For years, extreme ultraviolet (EUV) lithography has been a promising technology that was supposed to help enable advanced chip scaling. But after years of R&D, EUV is still not in production despite major backing from the industry, vast resources and billions of dollars in funding. More recently, though, [gettech id="31045" comment="EUV"] lithography appears to be inching closer to pos... » read more

Issues And Options At 5nm


While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more