tag: Samsung

What Is Spin Torque MRAM?
By Mark LaPedus - 17 Aug, 2017 - Comments: 0

The memory market is going in several different directions at once. On one front, the traditional memory types, such as DRAM and flash, remain the workhorse technologies. Then, several vendors are readying the next-generation memory types. As part of an ongoing series, Semiconductor Engineering will explore where the new and traditional memory technologies are heading. For this segment, P... » read more

Memory Market: More Than ASPs At Risk
By Jim Feldhan - 17 Aug, 2017 - Comments: 1

By Adrienne Downey and Jim Feldhan In June 2016, the memory market emerged from its slump after reversing its 12-month ASP decline. Since then, we’ve seen a strong rebound for ASPs in both DRAM and NAND. Contributing to this recovery was the increasing demand in memory content per device across all end markets combined with a more controlled capital investment over the past several years.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Aug, 2017 - Comments: 0

Fab tools Lam Research held an analyst event this week. The company indicated that the industry is in the midst of a memory boom, including both DRAM and 3D NAND. According to Amit Daryanani, an analyst with RBC, here was one of the big takeaways at the event: “The memory spend portion of WFE is more sustainable than previously assumed due to end-market drivers such as big data, automation, ... » read more

Blog Review: Aug. 9
By Jesse Allen - 09 Aug, 2017 - Comments: 0

Cadence's Paul McLellan digs into a recently discovered vulnerability in the Broadcom Wi-Fi chip used in many smartphones and why it should be a wakeup call for SoC designers. Mentor's Craig Armenti considers whether work-in-process design data management is an asset or a liability. Synopsys' Thomas M. Tuerke notes that in code, as in medicine, proper hygiene is should be treated as a con... » read more

Packaging Enters New Phase
By Ed Sperling - 07 Aug, 2017 - Comments: 0

The race is on to make advanced packaging less expensive than shrinking everything down onto the same die—much less expensive, in fact. Following several years of speculation and rather shaky market predictions at the beginning of this decade, packaging houses and foundries spent the last four years proving that packaging really does provide a viable alternative to shrinking die in terms o... » read more

Cheaper Fan-Outs Ahead
By Mark LaPedus - 07 Aug, 2017 - Comments: 6

Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Jul, 2017 - Comments: 0

Chipmakers UMC has generated sales from its recently-announced 14nm finFET technology. The foundry vendor also plans to enter the 22nm process technology market. UMC will join other players in the 22nm arena, such as GlobalFoundries, Intel and TSMC. “So we do have a plan to introduce our 22nm as well and it will be available around 2018,” said Jason Wang, the newly appointed co-president o... » read more

Blog Review: July 26
By Jesse Allen - 26 Jul, 2017 - Comments: 1

Mentor's Dan Driscoll digs into designing for safety and security on the Xilinx UltraScale+ MPSoC and the different mechanisms that support subsystem isolation. Cadence's Paul McLellan listens in on a talk by Bosch's Volkmar Denner on the future of communications and AI in connected autos. Synopsys' Robert Vamosi points to a recently-discovered vulnerability that could be present in thous... » read more

What’s After FinFETs?
By Mark LaPedus - 24 Jul, 2017 - Comments: 3

Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it's still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next. The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Jul, 2017 - Comments: 1

Fab equipment ASML posted strong sales in the quarter and is apparently nearly sold out of scanners based on extreme ultraviolet (EUV) lithography, according to analysts. “ASML posted strong 2Q results and 2Q guidance, providing further evidence that demand remains high for semiconductor equipment,” said Weston Twigg, an analyst with KeyBanc Capital Markets, in a research note. “Demand d... » read more

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