tag: Samsung

What’s After 7nm?
By Ed Sperling - 14 Sep, 2017 - Comments: 1

The rollout of 10/7nm was a long time coming, and for good reason. It's hard stuff, and chipmakers have to be ready to take a giant step forward with new processes, tools, and to deal with a slew of physical effects that no longer can be handled by just guard-banding a design. The big question is what's next, when it will happen, and how much it will cost. Preparing for the next process node... » read more

Survey: Optimism Grows for EUV
By Mark LaPedus - 11 Sep, 2017 - Comments: 1

The optimism is growing for extreme ultraviolet (EUV) lithography in the market, according to a pair of new surveys released by the eBeam Initiative, which also revealed some new and surprising data about mask writing tools and other photomask technology. In one of the surveys from the [getentity id="22818" e_name="eBeam Initiative"], respondents revealed that they are more optimistic than e... » read more

Get Ready For In-Mold Electronics
By Jeff Dorsch - 11 Sep, 2017 - Comments: 1

Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

The Week In Review: Design
By Jesse Allen - 08 Sep, 2017 - Comments: 0

Tools Cadence unveiled an integrated memory design and verification tool, with environments for bitcell design, array and complier verification, and memory characterization. It utilizes existing simulation databases for multi-corner and Monte Carlo analysis, which the company says can lead to a 2X runtime improvement. Solido Design Automation uncorked PVTMC Verifier, which uses machine lear... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Sep, 2017 - Comments: 0

Fab tools In a move to expand its product portfolio, Lam Research has acquired Coventor, a provider of simulation and modeling solutions for the semiconductor and MEMS industries. Lam Research held an analyst event at the recent Flash Memory Summit. The topics included 3D NAND and other technologies. In a blog, here’s what executives from Lam said at the event. Analysts from RBC Cap... » read more

Executive Insight: Wally Rhines
By Ed Sperling - 31 Aug, 2017 - Comments: 2

Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to talk about industry consolidation, a shift in emphasis from chips to systems, and what the recent acquisition by Siemens will mean for Mentor. What follows are excerpts of that conversation. SE: A year ago it looked as if the entire industry was going to b... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Aug, 2017 - Comments: 0

Packaging and test IoT chip startup zGlue recently announced its technology, dubbed the zGlue Integrated Platform (ZiP). In ZiP, chip customers select and configure their designs based on chiplets. Chiplets are proven silicon IP from existing vendors. Then, the technology automatically generates potential implementations of a design. As part of the effort, zGlue has selected Advanced Semicondu... » read more

Four Foundries Back MRAM
By Mark LaPedus - 23 Aug, 2017 - Comments: 4

Four major foundries plan to offer MRAM as an embedded memory solution by this year or next, setting the stage for what finally could prove to be a game-changer for this next-generation memory technology. GlobalFoundries, Samsung, TSMC and UMC plan to start offering spin-transfer torque magnetoresistive RAM (ST-MRAM or STT-MRAM) as an alternative or a replacement to NOR flash, possibly start... » read more

Silicon Wafers: M&A, Price Hikes
By Mark LaPedus - 17 Aug, 2017 - Comments: 0

Chipmakers need to keep a close eye on the silicon wafer industry, as the business continues to undergo a number of changes. On one front, the silicon wafer industry continues to consolidate. Then, after years of suffering from an oversupply and falling prices, many silicon wafer vendors are experiencing tight supply and have begun to raise prices. Silicon wafers are a fundamental part of... » read more

Why Fabs Worry About Tool Parts
By Mark LaPedus - 17 Aug, 2017 - Comments: 2

Achieving high yields with acceptable costs is becoming much more difficult as chipmakers migrate to next-generation 3D NAND and finFET devices—but not just because of rising complexity or lithography issues. To fabricate an advanced logic chip, for example, a wafer moves from one piece of equipment to another in what amounts to 1,000 process steps or more in a fab. Any glitch with the equ... » read more

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