tag: semiconductor

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 May, 2020 - Comments: 0

Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 May, 2020 - Comments: 0

Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 May, 2020 - Comments: 0

Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

New Uses For Manufacturing Data
By Ed Sperling - 12 May, 2020 - Comments: 0

The semiconductor industry is becoming more reliant on data analytics to ensure that a chip will work as expected over its projected lifetime, but that data is frequently inconsistent or incomplete, and some of the most useful data is being hoarded by companies for competitive reasons. The volume of data is rising at each new process node, where there are simply more things to keep track of,... » read more

Key Drivers In New Chip Industry Outlook
By Ed Sperling - 04 May, 2020 - Comments: 0

How well the semiconductor industry fares over the next 12 to 24 months depends upon the evolution of a virus. That alone will determine the correct model for an economic rebound — V, U, extended U, or maybe even a double U. But what's also becoming clear is those models don't apply uniformly to all sectors or sub-sectors of the semiconductor industry. Looked at as a whole, the entire indu... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 May, 2020 - Comments: 0

Fab tools The U.S. Department of Commerce has announced new export control actions to prevent China, Russia, and Venezuela from obtaining U.S. technology for military purposes. This expands the “Military End Use/User Controls (MEU)” license requirement controls on China, Russia, and Venezuela, covering military end-users, as well as semiconductor equipment, sensors and other technologies. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Apr, 2020 - Comments: 0

Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Big Changes In Tiny Interconnects
By Ed Sperling - 16 Apr, 2020 - Comments: 1

One of the fundamental components of a semiconductor, the interconnect, is undergoing radical changes as chips scale below 7nm. Some of the most pronounced shifts are occurring at the lowest metal layers. As more and smaller transistors are packed onto a die, and as more data is processed and moved both on and off a chip or across a package, the materials used to make those interconnects, th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Apr, 2020 - Comments: 0

Fab tool shipping costs The coronavirus is impacting semiconductor equipment companies. Many have withdrawn their previous forecasts. “It has also led to a rise in shipping costs,” said Krish Sankar, an analyst with Cowen, in a research note. Most semiconductor equipment and components are shipped via air, according to Sankar. The exception is flat-panel display equipment and other sys... » read more

Medical, Industrial & Aerospace IC Design Changes
By Ann Mutschler - 30 Mar, 2020 - Comments: 0

Medical, industrial and aerospace chips are becoming much more complex as more intelligence is added into these devices, forcing design teams to begin leveraging tools and methodologies that typically have been used only at the leading-edge nodes for commercial applications. But as with automotive, the needs of these systems are changing quickly. In addition to strict quality, safety and sec... » read more

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