Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Startup Funding: Q3 2025


The third quarter of 2025 was dominated by massive rounds for companies developing AI chips and quantum computers. Over $2.5 billion went to AI, with wafer-scale chip maker Cerebras leading the pack with a $1.1 billion raise. While several edge AI companies received backing, the quarter saw a marked shift towards solutions for the data center as firms seek to reduce the cost and power consumpti... » read more

Chip Industry Week In Review


GlobalFoundries plans to acquire MIPS, adding RISC-V processor IP and PPA optimization software capabilities to its foundry offerings. MIPS will continue to operate as a standalone business within GF. The deal is expected to close in the second half of 2025. The EU rolled out new general-purpose AI rules this week to limit copyright infringement, protect public safety, and require transparency... » read more

Chip Industry Week In Review


By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Startup Funding: April 2023


Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Week In Review: Design, Low Power


MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Week In Review: Design, Low Power


Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Week In Review: Auto, Security, Pervasive Computing


From pandemic to war — some of the news this week highlights reactions to Russia’s invasion of Ukraine. Pervasive computing, IoT, 5G and beyond SpaceX sent Starlink satellite dishes to Ukraine to enable Ukrainian access to the Internet. The caveat is the uplink signals from satellite equipment can be used to triangulate the position of the dish, which can then be hit by missile. The dis... » read more

Startup Funding: December 2021


Chinese startups dominated last month's fundraising, with companies from the country comprising about two-thirds of those covered in this report. In addition to the number of companies, startups from China also drew significant amounts of funding, with a display driver company and an EV battery maker each garnering around $1B and six more companies seeing rounds over $100M. Two particularly ... » read more

Week In Review: Design, Low Power


Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

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