tag: stacked die

Bigger Pipes, New Priorities
By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ann Steffora Mutschler From the impact of stacking on memory subsystems to advances in computing architecture, Micron Technology is at the forefront in the memory industry. System-Level Design sat down to discuss challenges, as well as some possible solutions, that plague memory subsystem architects with Scott Graham, general manager for Micron’s Hybrid Memory Cube (HMC) and Joe Jeddeloh,... » read more

The Challenge of 3D
By Ed Sperling - 06 Jul, 2011 - Comments: 0

Juan Rey, senior director of engineering for Mentor Graphics' Design To Silicon Division, talks about 3D stacking and 3D structures on chips. [youtube vid=YiH5IkxiEHU] » read more

Not So Fast
By Ed Sperling - 01 Jul, 2011 - Comments: 0

Semiconductor engineering has always been about taking two steps forward and one step back. Or, if you’re more cynical, you don’t really move at all. You just get better at what you do. The cynical approach is that nothing is really new because it’s all been done before. In effect, 2.5D packages are multi-chip modules with a better business case and more advanced versions of what exist... » read more

Standards Wanted
By Ed Sperling - 30 Jun, 2011 - Comments: 0

Over the next few years, as the industry moves to stacked die of various sorts—2.5D, 3D, system-in-package, package-on-package, and probably some others we haven’t considered yet—there will be a major need for standards. We will need standards for placement, interconnects, power leakage, characterization of IP and a slew of other things we haven’t even thought about yet. Most compani... » read more

Need To Know Basis
By Ed Sperling - 16 Jun, 2011 - Comments: 0

There’s a great and often over-used line out of movie scripts when the hero stumbles upon something that doesn’t make sense and he’s told, “That’s on a need-to-know basis.” The same seems to be true in low-power engineering. While everyone talks about the need for reducing the power inside of chips, the reality is that only the really advanced SoC and processor companies are taki... » read more

Cyclical Behavior
By Ed Sperling - 26 May, 2011 - Comments: 0

As we head into yet another DAC, this may seem like a bad case of déjà vu. While there’s plenty of new stuff—and even some new companies—there are some key trends that seem very familiar. Here are four to consider: 1. Cloud computing. For anyone who’s old enough to remember time-sharing on university computers, cloud computing should look very familiar. The scheduling is more so... » read more

Understanding Frog Behavior
By Ed Sperling - 20 May, 2011 - Comments: 0

Change is rarely something people can grasp, particularly in technology. Unless it involves a completely new way of doing things—witness the PC, the cell phone and the Internet, for example—most change involves evolutionary improvements. This is the proverbial frog in a pot of boiling water. Heat the frog up slowly and it will cook. Throw the frog into boiling water and it will leap to s... » read more

‘What If’ In 3D
By Ed Sperling - 28 Apr, 2011 - Comments: 0

By Ed Sperling ‘What if’ questions have become standard across multiple pieces of the design chain for any SoC, but the number is multiplying at each new process node. When the industry begins moving to 2.5D and 3D over the next couple years, the number of tradeoffs will likely move from overwhelming to unmanageable. That will set in motion a number of efforts in semiconductor design. ... » read more

Memory, Bandwidth And SoC Performance
By Ed Sperling - 24 Feb, 2011 - Comments: 0

By Ann Steffora Mutschler High-end SoC architectures today can contain dozens of processing engines—multiple cores from MIPS and ARM, DSPs from Tensilica and CEVA, and even graphics processors. But with so many cores there also is a need for enormous amounts of memory, and that has been creating some unexpected design problems, In many cases so much memory is required for an SoC that some... » read more

Deja Vu All Over Again
By Ed Sperling - 27 Jan, 2011 - Comments: 0

Every now and then you get the feeling you’ve been here before, and with technology this is a persistent theme. Virtualization looks remarkably similar to time sharing, which is what most engineers in their 40s and 50s used when they were in college. And 3D stacking, particularly the 2.5D version, looks eerily like the old MCM, aka multi-chip module. There’s nothing wrong with resurre... » read more

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