The Evolution Of Hardware Root Of Trust Security IP


Navigate hardware-based security for semiconductors with this white paper about tRoot Hardware Secure Modules (HSMs). This paper provides security solutions for protecting digital assets in an increasingly interconnected world. Key Takeaways: Understand why robust security measures are needed for AI, IoT, and high-performance computing. Discover tRoot HSMs features, including secure ... » read more

Blog Review: Jan. 7


Cadence's Reela Samuel presents an overview of through-silicon vias, including structure, pitch, and electrical behavior, key layout rules such as keep-out zones and stress constraints, and how TSV parasitics influence bandwidth, latency, and system-level performance. Siemens' Andras Vass-Varnai identifies five thermal trends to watch and how they’ll reshape design and packaging workflows ... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry Week In Review


Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

Blog Review: Dec. 24


Cadence's Jakob Engblom shares highlights from the recent SDV Europe conference, including why software-defined vehicles will require much closer, faster collaboration between suppliers and customers, with virtualization for software development and testing taking on a key role, as well as API questions and tire sensors. Synopsys' Tom De Schutter and Marc Serughetti predict that new cars wil... » read more

Software-Defined Hardware-Assisted Verification: Scaling To Quadrillions Of Cycles For Verification In The AI Era


The semiconductor industry is at an inflection point. The convergence of advanced multi-die architectures, AI-driven workloads, and rapidly evolving interface protocols is creating unprecedented design complexity. At the same time, market pressures demand faster time-to-market and higher performance, leaving little room for error. From data center to edge developments, users have to run softwar... » read more

When To Move To Multi-Die Assemblies


As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it's often not feasible to fit everything onto a single planar die. But determining when to move to a multi-die assembly isn't always straightforward. Multi-die approaches have some well-documented benefits. They allow designers to split functions across different dies, which can impro... » read more

Minimizing Design Risk: Rapid Feasibility Exploration For Multi-Die Designs


Multi-die design is revolutionizing semiconductor innovation, offering unprecedented flexibility, but also introducing complexity. What if designers could spot and solve critical issues, such as IR drop, electromigration, and thermal impact before they ever reach the design implementation stage? In this white paper, we explore how rapid, comprehensive feasibility exploration enables desi... » read more

2025 – A Year Of Change And Anticipation


2025 has certainly been a year of unexpected changes. These had a significant impact on the semiconductor industry and everything that supports it. Not all the changes have been bad, but flexibility has been a requirement for continued success or to make the most of an opportunity provided. Some industries, such as aerospace and defense, are seeing a significant boost around the world. Data ... » read more

Programmable Chips Evolve For Shifting Needs


ICs and SoCs are utilizing a range of processing elements that allow them to optimize current workloads while hedging their bets for the future. What used to be a simple choice between an ASIC, FPGA, or DSP, has evolved into a mix of processor types and architectures, including varying levels of programmability and customization. Speed is essential, but technology is evolving so quickly that... » read more

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