Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Week In Review: Manufacturing, Test


Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

Week In Review: Design, Low Power


Synopsys acquired Light Tec, a provider of optical scattering measurements and measurement equipment. The company also provides optical engineering consulting services plus training for use of Synopsys' lighting simulation software. "Light Tec's proven optical measurement capabilities provide our customers with robust new tools for high-accuracy optical product simulations and visualizations," ... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — Data centers, cloud, 5G, edge In a move to improve data collection for IC manufacturing, PDF Solutions entered a definitive agreement to acquire Cimetrix Incorporated. Cimetrix makes connectivity products for smart manufacturing, which PDF Solutions will use in its Exensio product to facilitate moving IC manufacturing data from the factory floor to cloud-based analytics... » read more

Blog Review: Nov. 18


Arm's Roberto Lopez Mendez finds that holographic displays can now be achieved on mobile processors thanks to recent algorithmic and computational advances. Mentor's Colin Walls examines the reasons the consolidate a number of automotive sub-systems onto a smaller number of powerful ECU to reduce complexity and increase system reliability. Cadence's Paul McLellan takes a look at the devel... » read more

Week In Review: Design, Low Power


M&A Synopsys acquired Moortec, a provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors. Moortec's sensors will be a key component to Synopsys' new Silicon Lifecycle Management (SLM) platform. "This acquisition accelerates the expansion of our SLM platform by providing our customers with a comprehensive data-analytics-driven solution for de... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Cadence achieved ASIL Level B in support of D (ASIL B(D))-compliant certification for its Tensilica ConnX B10 and ConnX B20 DSPs, which are designed for automotive radar, lidar, and vehicle-to-everything (V2X). SGS-TÜV Saar certified that the DSPs have support for random hardware faults and systematic faults. Synopsys is acquiring Moortec, whose process, voltage, and temperature... » read more

Designs Beyond The Reticle Limit


Designs continue to grow in size and complexity, but today they are reaching both physical and economic challenges. These challenges are causing a reversal of the integration trend that has provided much of the performance and power gains over the past couple of decades. The industry, far from giving up, is exploring new ways to enable designs to go beyond the reticle size, which is around 8... » read more

Dealing With Sub-Threshold Variation


Chipmakers are pushing into sub-threshold operation in an effort to prolong battery life and reduce energy costs, adding a whole new set of challenges for design teams. While process and environmental variation long have been concerns for advanced silicon process nodes, most designs operate in the standard “super-threshold” regime. Sub-threshold designs, in contrast, have unique variatio... » read more

Difficult Memory Choices In AI Systems


The number of memory choices and architectures is exploding, driven by the rapid evolution in AI and machine learning chips being designed for a wide range of very different end markets and systems. Models for some of these systems can range in size from 10 billion to 100 billion parameters, and they can vary greatly from one chip or application to the next. Neural network training and infer... » read more

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