Week In Review: IoT, Security, Automotive


Automotive Porsche’s electric race car, the 99X Electric, used ANSYS Technology’s system-level simulation solutions to create an advanced electric powertrain. The powertrain is also being adapted for use in Porsche’s consumer electric cars. "ANSYS system-level simulations are instrumental for optimizing the Porsche E-Performance Powertrain's motor, gearbox, power electronics and control ... » read more

Die-To-Die Connectivity


Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

Blog Review: Nov. 20


Arm's Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is completely wireless. Cadence's Paul McLellan checks in on the progress of DARPA's OpenROAD project to build a no-human-in-the-loop open source EDA flow for leading-edge nodes. Mentor's Colin ... » read more

Why Standard Memory Choices Are So Confusing


System architects increasingly are developing custom memory architectures based upon specific use cases, adding to the complexity of the design process even though the basic memory building blocks have been around for more than half a century. The number of tradeoffs has skyrocketed along with the volume of data. Memory bandwidth is now a gating factor for applications, and traditional memor... » read more

Week In Review: Design, Low Power


M&A eSilicon will be acquired by Inphi Corporation and Synopsys. Inphi is acquiring the majority of the company, including the ASIC business and 56/112G SerDes design and related IP, for $216 million in both cash and the assumption of debt. Inphi expects to combine its DSP, TiA, Driver and SiPho products with eSilicon’s 2.5D packaging and custom silicon design capabilities for electro-optics... » read more

Week in Review: IoT, Security, Automotive


Connectivity, 5G Rambus has revealed a PCI Express 5.0 interface on advanced 7nm finFET process node for heterogenous computing aimed at performance-intensive uses, such as AI, data center, HPC, storage and 400GbE networking. With a PHY and a digital controller core recently acquired Northwest Logic, the interface has 32 GT/s (gigatransfers per second) bandwidth per lane with 128 GB/s bandwidt... » read more

Implementing Low-Power Machine Learning In Smart IoT Applications


By Pieter van der Wolf and Dmitry Zakharov Increasingly, machine learning (ML) is being used to build devices with advanced functionalities. These devices apply machine learning technology that has been trained to recognize certain complex patterns from data captured by one or more sensors, such as voice commands captured by a microphone, and then performs an appropriate action. For example,... » read more

Power Complexity On The Rise


New chip architectures and custom applications are adding significant challenges to chip design and verification, and the problems are becoming much more complex as low power is added into the mix. Power always has been a consideration in design, but in the past it typically involved different power domains that were either on, off, or in some level of sleep mode. As hardware architectures s... » read more

Blog Review: Nov. 13


Applied Materials' Buvna Ayyagari-Sangamalli argues that the siloed structure that produced the computing eras of the past will not be sufficient to fuel the AI era and that a new codesign approach to everything from architecture to materials is needed. Arm's Wendy Elsasser examines emerging non-volatile memories and how they have triggered innovation for new memory protocols and optimized s... » read more

Verdi Transaction Debug Solution: Unified Performance Analysis And Debug For Interconnect


In modern systems on chip (SoCs), where Arm AMBA protocols are intensively used as standard intellectual property (IP) interfaces, the interconnect is usually required to bridge and facilitate the communication between many different IP interfaces. The interconnect presents one of the biggest challenges of SoC verification, considering the different kinds of protocol interfaces, conversion of d... » read more

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