tag: Texas Instruments

200mm Shortages May Persist For Years
By Mark LaPedus - 20 Jan, 2022 - Comments: 2

A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

Coping With Parallel Test Site-to-Site Variation
By Anne Meixner - 09 Nov, 2021 - Comments: 1

Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

Power/Performance Bits: Aug. 3
By Jesse Allen - 03 Aug, 2021 - Comments: 0

Efficient ADC Researchers at Brigham Young University, National Yang Ming Chiao Tung University, Texas Instruments, and University of California Los Angeles designed a new power-efficient high-speed analog-to-digital converter. The ADC consumes only 21 milli-Watts of power at 10GHz for ultra-wideband wireless communications, much lower than other ADCs that consume hundreds of milli-Watts to... » read more

Geo-Spatial Outlier Detection
By Anne Meixner - 19 Jul, 2021 - Comments: 0

Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and why. The main idea in outlier detection is to find something in or on a die that is different from all the other dies on a wafer. Doing this in the context of a die’s neighbor has become easie... » read more

Massive IoT Interop Fuels Protocol Battle
By Bryon Moyer - 15 Jul, 2021 - Comments: 0

Wireless standards are plentiful, but most are not capable of being scaled to the level of a smart city. As a result, such networks have been built application-by-application using proprietary stacks, often with non-interoperable network layers. That, in turn, has slowed the proliferation of dense wireless connectivity at scale. “In a hyper-connected world, connectivity choices are driv... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

Firmware Skills Shortage
By Brian Bailey - 25 Feb, 2021 - Comments: 0

Good hardware without good software is a waste of silicon, but with so many new processors and accelerator architectures being created, and so many new skills required, companies are finding it hard to hire enough engineers with low-level software expertise to satisfy the demand. Writing compilers, mappers and optimization software does not have the same level of pizazz as developing new AI ... » read more

Part Average Tests For Auto ICs Not Good Enough
By Anne Meixner - 24 Feb, 2021 - Comments: 0

Part Average Testing (PAT) has long been used in automotive. For some semiconductor technologies it remains viable, while for others it is no longer good enough. Automakers are bracing for chips developed at advanced process nodes with much trepidation. Tight control of their supply chains and a reliance upon mature electronic processes so far have enabled them to increase electronic compone... » read more

Power Converter Chip Research Booms
By Katherine Derbyshire - 18 Feb, 2021 - Comments: 0

Power electronics are booming, fueled by demand ranging from induction chargers for wearable and portable electronics, to charging stagings for electric vehicles. An estimated 80% of all U.S. electricity will pass through some form of power converter by 2030, said Yogesh Ramadass, director of power management at Texas Instruments' Kilby Labs. Transportation applications, in particular, deman... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Feb, 2021 - Comments: 0

Chipmakers The U.S. Semiconductor Industry Association (SIA) and several chip executives have sent a joint letter to President Biden, urging the administration to include substantial funding for semiconductor manufacturing and research in the U.S. As reported, the share of global semiconductor manufacturing capacity in the U.S. has decreased from 37% in 1990 to 12% today. “Semiconductors pow... » read more

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