Thermal Characterization For Power Semiconductor Packages (KATECH)


Researchers from Korea Automotive Technology Institute published "Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling." Abstract "Junction-to-case thermal resistance (RthJC ) is a critical parameter for assessing the reliability and thermal performance of power semiconductor devices. Conventional JEDEC-ba... » read more

Thermal Characterization of Complex Electronics


This whitepaper describes the role of thermal transient measurement to characterize semiconductor thermal behavior. It focuses on the value measurement derived structure functions provide through interpretation of the heat flow path inside a package for use in thermal characterization, failure diagnosis, and improving simulation thermal model accuracy. Structure functions transform thermal t... » read more