Thermal Sensing Headache Finally Over For 2nm And Beyond


Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing compromises power management, reliability, processing speed, and lifespan, leading to issues like electromigration, hot carrier injection, and even thermal runaway. Unfortunately, precise thermal monitoring reached an inflect... » read more

How Multiphysics Is Powering The Future Of 3D-ICs


It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already thinking vertically. By 1983, Fujitsu manufactured the first 3D IC prototype using through-silicon via (TSV) technology, using laser beam recrystallization. That’s a long time for a good idea to catc... » read more

Digital Engineering Transforms Chips For The Future


The semiconductor industry stands at a critical turning point. With global semiconductor sales exceeding $600 billion last year, the need for the industry to scale has never been more apparent. As AI applications drive unprecedented requirements for processing capabilities, chip designers are turning to advanced simulation technologies to enable the digital engineering workflows that will sup... » read more

Baby, It’s Hot Outside!


Electronics manufacturing production sites are ideal places to be during the summer because they maintain controlled temperatures. It’s well known that 23°C (74°F) is the ideal temperature inside electronics manufacturing areas. However, when the outside temperature reaches 40°C (104°F), the air conditioning system may struggle to maintain this lower value indoors. Many companies estab... » read more

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces


In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) pa... » read more

A Better Path To Better 3D-IC Thermal Modeling


By Andras Vass-Varnai, Lee Wang, John Parry, Byron Blackmore, and Sudarshan Deo In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits has become a make-or-break factor in product success. The traditional approach of treating thermal analysis as an ... » read more

Power Delivery Challenges For AI Chips


As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

Industry Leaders Provide Insights And Guidance On Multi-Die Designs


Multi-die designs seamlessly integrate multiple heterogeneous or homogeneous dies in a single package to significantly enhance chip performance and efficiency — making them indispensable for high-performance computing (HPC), artificial intelligence (AI), data analytics, advanced graphics processing, and other demanding applications. While representing a groundbreaking leap forward, multi-d... » read more

Research Bits: May 13


Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

Research Bits: Apr. 29


Microchannels for two-phase cooling Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The method utilizes microfluidic channels to create a capillary structure through which coolant flows and a manifold distribution layer that controls the distribution of coolant. The structure enabled two-phase cooling through better managem... » read more

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