tag: Tignis

Using AI For Fault Detection And Classification In Manufacturing
By Ed Sperling - 05 Sep, 2025 - Comments: 0

Third in a seven-part series: Classic fault detection and classification has some classic problems. It's reactive, time-consuming to set up, and any product change involves significant man-hours. Even then, it still misses a lot of problems, which result in scrap. This is where machine learning can excel, because it can sift through huge amounts of data from thousands of sensors and find outlie... » read more

How Semiconductor Fabs Use Water
By Gregory Haley - 25 Aug, 2025 - Comments: 0

Water — lots of it — is a critical enabler for advanced chip architectures, lithography, and back-end packaging. It feeds the ultra-pure water loops that touch every wafer, sluicing heat out of tools that run hotter at each node, and carrying spent chemistries to treatment. The natural reaction to reports that fabs “use millions of gallons of water” is concern, but the engineering re... » read more

Machine Learning In Semiconductor Manufacturing
By Ed Sperling - 22 Aug, 2025 - Comments: 0

Second in a seven-part series: Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but it remains relevant even today. It can be applied to semiconductor fab for such things as predictive maintenance of manufacturing equipment, rather than just maintenance on a schedule, which decreases downtime. But getting this right is har... » read more

AI, From A To Z
By Ed Sperling - 15 Aug, 2025 - Comments: 0

First in a seven-part series: What's the difference between AI, ML, DL, LLMs, and agentic AI? Is it truly revolutionary, or is it an evolutionary series of steps that have enabled machines to do much more than in the past? Jon Herlocker, vice president and general manager of software analytics at Cohu, talks about the evolution of AI over nearly 70 years, the chain of innovation that has enable... » read more

Chip Industry Week in Review
By The SE Staff - 15 Aug, 2025 - Comments: 0

Lines are blurring between government and industry: On the heels of last week's resignation demand, Intel CEO Lip-Bu Tan met with President Trump on Monday, with the President later saying, "The meeting was a very interesting one. His success and rise is an amazing story."  Now, Bloomberg reports the Trump administration is in talks with Intel for the U.S. government to take a stake in th... » read more

How Advanced Packaging Is Reshaping Inspection
By Gregory Haley - 10 Jul, 2025 - Comments: 0

As semiconductor devices continue advancing into more sophisticated packaging schemes, traditional optical inspection technologies are brushing up against physical and computational boundaries. The growing reliance on 2.5D and 3D integration, hybrid bonding, and wafer-level processes has made it much harder to detect defects consistently and early enough to protect yields. While optical insp... » read more

Detecting Slips, Scratches, Cracks In Wafers And Dies Becoming Harder
By Anne Meixner - 10 Jul, 2025 - Comments: 0

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection tools’ resolution and throughput at foundries and OSATs. However, defects that manifest as slips, scratches, and micro-cracks continue to bedevil the prevalent optical inspection methods. These defects can range in size from nanometers to millimeters, some of which are... » read more

High-Quality Data Needed To Better Utilize Fab Data Streams
By Anne Meixner - 10 Jun, 2025 - Comments: 0

Fab operations have wrestled with big data management issues for decades. Standards help, but only if sufficient attention to detail is taken during collection. Semiconductor wafer manufacturing represents one of the most complex manufacturing processes in the world. With each generation of process improvement comes more sophisticated fab equipment, new process recipes, and exponential incre... » read more

Packaging With Fewer People And Better Results
By Gregory Haley - 17 Apr, 2025 - Comments: 1

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Why Thin Film Measurements Matter
By Laura Peters - 08 Apr, 2025 - Comments: 0

Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward first-silicon, the importance of precise film measurement is only growing in significance as fabs seek to maintain the performance and reliability of leading-edge devices. Whether it’s the read and writ... » read more

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