Week In Review: Manufacturing, Test

By Mark LaPedus - 19 Jun, 2020 - Comments: 0

Chipmakers and OEMs At next week’s Apple Worldwide Developers Conference, Apple is expected to roll out its long-awaited Arm-based Mac computers. This could provide a boost for Apple’s foundry vendor as well as equipment makers. It’s the worst-kept secret in the industry. As reported by the Apple sites, Apple is moving from Intel’s microprocessors to its own Arm-based chips for th... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 28 Feb, 2020 - Comments: 2

SPIE At the SPIE Advanced Lithography conference, Lam Research has introduced a new dry resist technology for extreme ultraviolet (EUV) lithography. Dry resist technology is a new approach to deposit and develop EUV resists. It is a dry deposition technique with alternate compositions and mechanisms. By combining Lam’s deposition and etch process expertise with partnerships with ASML a... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 20 Dec, 2019 - Comments: 0

Fab tools and materials In a blog, David Haynes, managing director of strategic marketing at Lam Research, talks about the IoT and automotive chip markets, which are fabricated at a wide range of technology nodes. Hoya recently made an unsolicited $1.4 billion bid to acquire NuFlare, a supplier of e-beam mask writers and other equipment. Click here for more information. Hoya makes several p... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test