Securing The Mobile IoT

By Synopsys - 05 Jun, 2019 - Comments: 0

It’s 2019. Security fears, locked ecosystems, and lack of technology are keeping IoT products within WiFi networks, and not reaching their full potential. As an industry, we must provide IoT solutions that are simple and keep consumers--and their data--secure.The mobile IoT is the next frontier in the connected device market, providing out-of-the-box connectivity with security from silicon... » read more

Week In Review: Design, Low Power

By Jesse Allen - 14 Sep, 2018 - Comments: 0

M&A Intel acquired NetSpeed Systems, a network-on-a-chip and interconnect fabric IP and tool provider. Founded in 2011, the San Jose-based company recently put a focus on interconnects designed with AI applications in mind. Intel has cast the acquisition as a way to tie a number of its other technologies together. The team will join Intel's Silicon Engineering Group. Intel has been a NetSp... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Sep, 2018 - Comments: 0

Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

The Week in Review: IoT

By Jeff Dorsch - 20 Oct, 2017 - Comments: 0

Acquisitions ASSA ABLOY has agreed to acquire August Home, a startup providing home security products; the purchase price wasn’t revealed. August Home, which raised $75 million in private funding, should fit well with the Scandinavian conglomerate’s Yale lock business. The transaction is subject to regulatory approval and customary closing conditions; it is expected to close by the end of ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Truphone

Securing The Mobile IoT

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

The Week in Review: IoT