tag: TSMC

Week In Review: Design, Low Power
By Jesse Allen - 05 Oct, 2018 - Comments: 0

Mirabilis Design debuted an AI-driven tool for performance analysis and architecture exploration of SoCs and embedded systems. VisualSim AI Processor Generator creates pipeline-accurate models that have port integration with standard buses and memories, which is used to compare different processor families, optimize the specification and identify system bottlenecks. The generated model supports... » read more

What Will Intel Do Next?
By Ed Sperling - 27 Sep, 2018 - Comments: 2

The writing is on the wall for big processor makers. Apple, Amazon, Facebook and Google are developing their own processors. In addition, there are more than 30 startups developing various types of AI accelerators, as well as a field of embedded FPGA vendors, a couple of discrete FPGA makers, and a slew of soft processor cores. This certainly hasn't been lost on Intel. As the world's largest... » read more

EUV Pellicle, Uptime And Resist Issues Continue
By Mark LaPedus - 26 Sep, 2018 - Comments: 0

Extreme ultraviolet (EUV) lithography is moving closer to realization, but several problems involving scanner uptime, photoresists and pellicles need to be resolved before this long-overdue technology is put into full production. Intel, Samsung and TSMC are hoping to insert EUV into production at 7nm and/or 5nm. While the remaining issues don’t necessarily pre-empt using EUV, they do affec... » read more

Survey: EUV Optimism Grows
By Mark LaPedus - 17 Sep, 2018 - Comments: 2

The confidence level remains high for extreme ultraviolet (EUV) lithography, although the timing of the insertion remains a moving target, according to a new survey released by the eBeam Initiative. At the same time, the outlook for the overall photomask industry is bullish, according to the survey. On the downside, however, there appears to be no progress in terms of improving mask turnaro... » read more

Aging In Advanced Nodes
By Ann Mutschler - 17 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; Magdy Abadir, vice president of marketing at ... » read more

Sorting Out Packaging Options
By Ed Sperling - 10 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial Te... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Sep, 2018 - Comments: 0

Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Aug, 2018 - Comments: 0

Chipmakers GlobalFoundries said that it is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. To be sure, it was a tough decision by GF to put 7nm on hold. But generally, analysts believe that GF made the right decision. “There’s only a handful of semiconductor companies that will require high-volume 7nm technology right when... » read more

GF Puts 7nm On Hold
By Mark LaPedus - 27 Aug, 2018 - Comments: 6

GlobalFoundries is putting its 7nm finFET program on hold indefinitely and has dropped plans to pursue technology nodes beyond 7nm. The moves, which mark a major shift in direction for the foundry, involve a headcount reduction of about 5% of its worldwide workforce. At the same time, the company is also moving its ASIC business into a new subsidiary. As a result of GlobalFoundries’ ann... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Aug, 2018 - Comments: 0

Trade wars The United States and China have escalated the ongoing trade war. Both sides have implemented 25% tariffs on $16 billion worth of each other’s goods, according to a report from Reuters. The U.S. and China have slapped a combined $100 billion in tariffs on products since early July, according to the report. In testimony before a U.S. government interagency panel on considering t... » read more

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