Status of WBG Device Reliability in Automotive (U. Bremen et al.)


A new technical paper, "Reliability of Wide Bandgap Semiconductors for Automotive Applications," was published by the Universitat Bremen, Technische Universitat Chemnitz, BMW, Robert Bosch GmbH, Infineon, Semikron Danfoss, and FH Dortmund. Abstract "Wide bandgap (WBG) semiconductor devices offer tremendous advantages over their silicon counterparts. Automotive applications benefit particu... » read more

Chip Industry Technical Paper Roundup: Oct. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=480 /] Find more semiconductor research papers here » read more

A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)


A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, University Bremen, Infineon and WavesenseDD GmbH. Abstract “Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant t... » read more