tag: Valeo

Chip Industry Week In Review
By The SE Staff - 29 Nov, 2024 - Comments: 0

Intel CEO Pat Gelsinger retired on Dec. 1, according to the company. He will be replaced by two interim co-CEOs, David Zinsner, who also continues to serve as CFO  and Michelle Johnston Holthaus, who has been named CEO of Intel Products. In addition, Frank Yeary was named interim executive chairman. Intel has been under pressure investors as non-traditional rivals, including Arm and NVIDIA, co... » read more

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry Week In Review
By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Dec, 2022 - Comments: 0

Automotive, Mobility The U.S. space agency NASA entered a $57.2 million contract with ICON to develop technology to build roads on the moon. ICON, a Texas-based 3D printing construction company, has been working with NASA and the U.S. Air Force on construction technologies that can use local materials to build infrastructure on Mars. NASA is working on advanced 3D printing construction systems... » read more

Multi-Task Network Pruning and Embedded Optimization for Real-time Deployment in ADAS
By Technical Paper Link - 15 Feb, 2022 - Comments: 0

Abstract: "Camera-based Deep Learning algorithms are increasingly needed for perception in Automated Driving systems. However, constraints from the automotive industry challenge the deployment of CNNs by imposing embedded systems with limited computational resources. In this paper, we propose an approach to embed a multi- task CNN network under such conditions on a commercial prototy... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 21 Dec, 2018 - Comments: 0

Internet of Things Unmanned aerial vehicles are delivering vaccines to the very remote village of Cook’s Bay, on the island of Erromango, one of 83 volcanic islands in the South Pacific nation of Vanuatu. The drones can go from island to island faster than boats, which often are not a travel option during rough weather. Vanuatu this week began its vaccine deliveries by drones with support fr... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 21 Nov, 2018 - Comments: 0

Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

Faster Commoditization In Cars
By Ann Mutschler - 02 Nov, 2017 - Comments: 0

Sensors are at the heart of assisted and autonomous driving, but even before these devices hit the road the average selling prices of these components will have to fall far enough to be affordable to a mass audience. Achieving economies of scale is what has made the semiconductor industry successful over the past half century. It has enabled semiconductors to proliferate and for electronics ... » read more

Advanced Packaging Moves To Cars
By Ann Mutschler - 07 Aug, 2017 - Comments: 0

By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slow�... » read more

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