A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, University Bremen, Infineon and WavesenseDD GmbH.
Abstract
“Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant t...
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