eFPGA Architectural Improvements That Lower Test Cost And Increase Quality
By Geoff Tate - 02 Nov, 2023 - Comments: 0

More than 40 chips have been licensed to use EFLX eFPGA and >20 chips are working in silicon. Big customers like Renesas are planning high volume families of chips using embedded FPGA. As a result, we have gained extensive experience and knowledge in almost 10 years of doing eFPGA especially in production test for cost reduction and reliability improvement. eFPGA DFT and MBIST for high q... » read more

Isolating Critical Data In Failure Analysis
By Anne Meixner - 01 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hakim, ASIC reliability engineer at Teradyne... » read more

2023 Open Source Security And Risk Analysis Report
By Synopsys - 01 Nov, 2023 - Comments: 0

The annual “Open Source Security and Risk Analysis” (OSSRA) report, now in its 8th edition, examines vulnerabilities and license conflicts found in roughly 1,700 codebases across 17 industries. The report offers recommendations for security, legal, risk, and development teams to better understand the security and risk landscape accompanying open source development and use. Click here to ... » read more

Blog Review: November 1
By Jesse Allen - 01 Nov, 2023 - Comments: 0

Cadence’s Rich Chang finds that although UVM has being used for testbench creation for more than a decade, it is still challenging to debug problems that are inside of UVM testbench. Siemens’ Keith Felton suggests that early analysis in complex advanced packaging flows can enable designers to spot potential issues early to avoid built-in constructs that cause design failures and require ... » read more

Usage Of Pulse-Edge Transformer In Secondary-Controlled Flyback Applications
By Infineon - 01 Nov, 2023 - Comments: 0

As the demand for smaller form factors and higher energy efficiency for charger/adapter grows, the wide bandgap (WBG) device technology is gaining popularity. To use the potential of WBG and thus improve the power density and efficiency, the switching frequency levels of converters are in the order of 300 kHz to 400 kHz. The higher switching frequency also requires faster control or response ti... » read more

Improving The Retention Characteristics Of 3D NAND Flash Memories
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “3D NAND Flash Memory Cell Current and Interference Characteristics Improvement With Multiple Dielectric Spacer” was published by researchers at Myongji University, Soongsil University, and Seoul National University. Abstract: "To achieve high density, the spacer length of three dimensional (3D) NAND device has been scaled down. When the program/erase cycle repeat... » read more

A New Architecture And Verification Approach For Hardware Security Modules
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “The K2 Architecture for Trustworthy Hardware Security Modules” was published by researchers at MIT Computer Science and Artificial Intelligence Laboratory (CSAIL) and New York University. Abstract: "K2 is a new architecture and verification approach for hardware security modules (HSMs). The K2 architecture's rigid separation between I/O, storage, and computation ... » read more

Potentials And Issues Of Designing Fault-Tolerant Hardware Acceleration For Edge-Computing Devices
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “Fault-Tolerant Hardware Acceleration for High-Performance Edge-Computing Nodes” was published by researchers at University of Rome. Abstract: "High-performance embedded systems with powerful processors, specialized hardware accelerators, and advanced software techniques are all key technologies driving the growth of the IoT. By combining hardware and software tec... » read more

A Modelling Approach To Well-Known And Exotic 2D Materials For Next-Gen FETs
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “Field-Effect Transistors based on 2-D Materials: a Modeling Perspective” was published by researchers at ETH Zurich. Abstract: "Two-dimensional (2D) materials are particularly attractive to build the channel of next-generation field-effect transistors (FETs) with gate lengths below 10-15 nm. Because the 2D technology has not yet reached the same level of maturity... » read more

Benefits Of Using Wireless Communication Technologies In Power Electronics Systems Employing AGDs
By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “Wireless Control of Active Gate Drivers for Silicon Carbide power MOSFETs” was published by researchers at Norwegian University of Science and Technology (NTNU). Abstract: "Active Gate Drivers (AGDs) enhance controllability and monitoring of switching devices, especially for fast switching Silicon Carbide (SiC) power Metal-Oxide-Semiconductor Field-Effect Transis... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy