AI For Circuit Design Quality, Productivity, And Advanced-Node Mapping
By Steve Brown - 26 Oct, 2023 - Comments: 0

The future of circuit design, encompassing analog, RF/5G, and custom electronic circuits, is set to be revolutionized by the integration of generative AI tools. These advanced tools will not only enhance the quality of designs and boost designer productivity but also facilitate the mapping of designs from older semiconductor process nodes to more advanced nodes such as 3nm and below. This blog ... » read more

Let’s Do The (IC Design) Time Warp Again
By John Ferguson - 26 Oct, 2023 - Comments: 0

For the most part, we’ve all been doing integrated circuit (IC) and system-on-chip (SoC) layout the same way for decades. Designers put together the design, be it intellectual property (IP), block, or full chip, then begin running physical verification. For design rule checking (DRC), this process consists of running all appropriate rule checks for the component on all available layouts. The ... » read more

Powering Up Electric Heavy-Duty Vehicles
By Hwee Yng Yeo - 26 Oct, 2023 - Comments: 0

Smokey tailpipe emissions may soon be a thing of the past, as the heavy transport vehicle market catches up with the electric car market to lower their contribution to greenhouse gas (GHG) emissions. Private sedans and light-duty trucks lead the vehicle electrification race, leaving much upside opportunity for heavy transport fleets such as trucks and buses to catch up. In the United Stat... » read more

Navigating EDA Vendor Cloud Options
By Ann Mutschler - 25 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the challenges of cost-dependent cloud decisions, and how to navigate between different EDA vendor clouds options with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Systems; Richard Ho, vice president hardware engineering ... » read more

Selective Radiation Mitigation For Integrated Circuits
By Siemens EDA - 25 Oct, 2023 - Comments: 0

Shortened lifecycles and cost reduction coupled with the demand for advanced capabilities continue to challenge project teams delivering IC into space systems. To meet these demands, project teams must continue to evolve across all aspects of the lifecycle, including the implementation and verification of mitigation protections against single event effects. This paper defines a methodology t... » read more

FIR And Median Filter Accelerators In CodAL
By Codasip - 25 Oct, 2023 - Comments: 0

5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G) which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable mul... » read more

ESD Co-Design For 224G And 112G SerDes In FinFET Technologies
By Synopsys - 25 Oct, 2023 - Comments: 0

In addressing the challenges of enhancing ESD resilience for high-speed SerDes interfaces, it's crucial to ensure the implementation of appropriate ESD protection measures. This is particularly vital during the device's lifecycle from the conclusion of silicon wafer processing to system assembly, a phase during which electronic devices are highly susceptible to Electrostatic Discharge (ESD) dam... » read more

Five Strategies To Accelerate 5G Device Development
By Keysight - 25 Oct, 2023 - Comments: 0

Designing and implementing 5G devices in new mmWave operating bands present new challenges. New technologies and evolving standards increase design complexity. Here are five strategies to help you address these challenges and get your designs to market faster. Click here to read more. » read more

Blog Review: October 25
By Jesse Allen - 25 Oct, 2023 - Comments: 0

Synopsys’ Graham Allan looks at enhancements in the LPDDR5X standard, such as a speed increase from 6.4Gbps to 8.5Gbps using the same 1.1V core voltage as LPDDR5 alongside better signal integrity, reliability, and battery efficiency. Cadence’s Krunal Patel examines the essential components and operation of MACsec, a security protocol to ensure the confidentiality and integrity of data tr... » read more

Why A DSP Is Indispensable In The New World of AI
By Cadence - 25 Oct, 2023 - Comments: 0

Chips being designed today for the automotive, mobile handset, AI-IoT (artificial intelligence - Internet of things), and other AI applications will be fabricated in a year or two, designed into end products that will hit the market in three or more years, and then have a product lifecycle of at least five years. These chips will be used in systems with a large number and various types of senso... » read more

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