Threat Modeling, Decoded — Charting The Security Journey
By Synopsys - 05 Apr, 2023 - Comments: 0

Connected systems are part of the modern world. There is virtually no aspect of life that is not available online, from shopping and booking tickets to dating, banking, and attending medical appointments. And these trends show no sign of stopping. On the contrary, many services are moving to digital-first or digital-only models, and every day, new products— from toasters to autonomous vehicle... » read more

XENSIV PAS CO2
By Infineon - 05 Apr, 2023 - Comments: 0

This white paper demonstrates how Infineon’s new CO2 sensor XENSIVTM PAS CO2, based on photo-acoustic spectroscopy (PAS) technology, is compatible with the sensor requirement defined by the WELL Building Standard and the LEED rating system. The evidence presented is based on conceptual and experimental data. The document also provides a detailed analysis of the contribution of the sen... » read more

Adding Security Into Test
By Ed Sperling - 04 Apr, 2023 - Comments: 0

Security is becoming a much bigger concern as more electronics are added into cars, as more devices are connected to the internet, and as the value of data continues to increase. The problem is that security is dynamic. It continues to change throughout the lifetime of a system, and some of these devices are expected to last for a decade or more. Lee Harrison, director of Tessent product market... » read more

Research Bits: April 4
By Jesse Allen - 04 Apr, 2023 - Comments: 0

Wet-like plasma etching Researchers from Nagoya University and Hitachi developed a new etch method called wet-like plasma etching that combines the selectivity of wet etching with the controllability of dry etching. The researchers say the technique will make it possible to etch complex structures such as metal carbides consisting of titanium (Ti) and aluminum (Al), such as TiC or TiAlC, wh... » read more

Chip Industry’s Technical Paper Roundup: Apr. 4
By Linda Christensen - 04 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=90 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Surface-Activated ALD For Room-Temperature Bonding of Al2O3
By Technical Paper Link - 03 Apr, 2023 - Comments: 0

A new technical paper titled "Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition" was published by researchers at Kyushu University. Abstract "In this study, room-temperature wafer bonding of Al2O3 thin films on Si thermal oxide wafers, which were deposited using atomic layer deposition (ALD), was realized using the surface-activated bonding (SAB) metho... » read more

Characteristics of Three-Gated Reconfigurable FETs
By Technical Paper Link - 03 Apr, 2023 - Comments: 0

A new technical paper titled "Insights into the Temperature Dependent Switching Behaviour of Three-Gated Reconfigurable Field Effect Transistors" was published by researchers at NaMLAB and TU Dresden. "In this work, it is possible to assess the performances of Three-Gated Reconfigurable Field Effect Transistors within a considerable temperature span and finally provide significant insights o... » read more

Neuromorphic Computing: Self-Adapting HW With ReRAMs
By Technical Paper Link - 03 Apr, 2023 - Comments: 0

A new technical paper titled "A self-adaptive hardware with resistive switching synapses for experience-based neurocomputing" was published by researchers at Infineon Technologies, Politecnico di Milano and IUNET, Weebit Nano, and CEA Leti. Abstract "Neurobiological systems continually interact with the surrounding environment to refine their behaviour toward the best possible reward. Achie... » read more

Using Photonic Band Gap in Triangular SiC Structures for Efficient Quantum Nanophotonic HW
By Technical Paper Link - 03 Apr, 2023 - Comments: 0

A new technical paper titled "Utilizing photonic band gap in triangular silicon carbide structures for efficient quantum nanophotonic hardware" was published by researchers at UC Davis. Abstract: "Silicon carbide is among the leading quantum information material platforms due to the long spin coherence and single-photon emitting properties of its color center defects. Applications of silico... » read more

Mechanical Challenges Rise With Heterogeneous Integration
By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy