Securing Next-Gen 5G And IoT With Defensics Fuzzing
By Synopsys - 04 Jan, 2023 - Comments: 0

Expansion of the IoT brings new security challenges The evolution of 5G technologies continues to drive advancement in Internet of Things (IoT) devices and their applications. By 2025, experts predict there will be nearly 4 billion IoT mobile connections in the world, and more than 64 billion IoT devices by 2026. In addition to enabling superior performance and efficiency, 5G expands the ... » read more

Tensilica DSPs Support In Eigen Library
By Cadence - 04 Jan, 2023 - Comments: 0

Eigen is a high-level C++ library of template headers for linear algebra, matrix and vector operations, geometrical transformations, numerical solvers, and related algorithms. Eigen is open-source software licensed under the Mozilla Public License 2.0 (MPL2). Eigen is implemented using the expression templates metaprogramming technique, meaning it builds expression trees at compile time... » read more

Chip Industry’s Technical Paper Roundup: Jan 3
By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Research Bits: Jan. 3
By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Graphene-Based Electronics (Georgia Tech)
By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "An epitaxial graphene platform for zero-energy edge state nanoelectronics" was published by researchers at Georgia Tech, Tianjin University, CNRS, Synchrotron SOLEIL, National High Magnetic Field Laboratory and others. “Graphene’s power lies in its flat, two-dimensional structure that is held together by the strongest chemical bonds known,” said Walter de Heer... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects
By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more

MTJ-based Circuits Provide Low-Cost, Energy Efficient Solution For Future Hardware Implementation in SC Algorithms
By Technical Paper Link - 30 Dec, 2022 - Comments: 0

A review paper titled "Review of Magnetic Tunnel Junctions for Stochastic Computing" was published by researchers at University of Minnesota Twin Cities. Funding agencies include Semiconductor Research Corporation (SRC), CAPSL, NIST, DARPA and others. Abstract: "Modern computing schemes require large circuit areas and large energy consumption for neuromorphic computing applications, such as... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 22 Dec, 2022 - Comments: 0

SEMI , SEMI Europe and European Commission representatives, in consultation with semiconductor industry stakeholders, proposed initiatives to overcome the skills shortage in Europe’s microelectronics industry: Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry. Remove ... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 22 Dec, 2022 - Comments: 0

RISC-V The European Union said it will spend the equivalent of $286.5 million on a high performance computing ecosystem based on RISC-V. According to the call for proposals, the aim of the project is to “establish a partnership between the EuroHPC JU and a consortium of industry, research organizations and institutions in HPC to the development of innovative HPC hardware and software technol... » read more

Multi-Beam Mask Writers Are A Game Changer
By Jan Willis - 22 Dec, 2022 - Comments: 0

The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth. A panel of experts debated remaining barriers to curvilinear photomask adoption during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 compan... » read more

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