Heterogeneous Assembly

By Promex Industries - 16 Nov, 2022 - Comments: 0

Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a cost-effective way, ideally using a rapid process development cycle to minimize time to market. Combining technologies, as well as combining... » read more

Metrology Of Thin Resist For High NA EUVL

By Nova - 16 Nov, 2022 - Comments: 0

One of the many constrains of high numerical aperture extreme ultraviolet lithography (High NA EUVL) is related to resist thickness. In fact, one of the consequences of moving from current 0.33NA to 0.55NA (high NA) is the depth of focus (DOF) reduction. In addition, as the resist feature lines shrink down to 8nm half pitch, it is essential to limit the aspect ratio to avoid pattern collapse. T... » read more

Research Bits: Nov. 15

By Jesse Allen - 15 Nov, 2022 - Comments: 0

Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15

By Linda Christensen - 15 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Managing IP In Heterogeneous Designs

By Ed Sperling - 14 Nov, 2022 - Comments: 0

Increasing complexity and heterogeneity is creating huge challenges for tracking different versions of IP over the lifetime of chips. Pedro Pires, applications engineer at ClioSoft, talks about the implications of IP reuse in a complex, multi-IP context, including how different standards and database formats can affect IP tracking and why an interoperability layer is essential to tracking IP an... » read more

Improving Reliability In Automobiles

By John Koon - 14 Nov, 2022 - Comments: 0

Carmakers are turning to predictive and preventive maintenance to improve the safety and reliability of increasingly electrified vehicles, setting the stage for more internal and external sensors, and more intelligence to interpret and react to the data generated by those sensors. The number of chips inside of vehicles has been steadily rising, regardless of whether they are powered by elect... » read more

Ensuring Memory Reliability Throughout the Silicon Lifecycle

By Anand Thiruvengadam - 14 Nov, 2022 - Comments: 0

By Anand Thiruvengadam and Guy Cortez Memories are everywhere in modern electronics. Discrete memory chips account for much of the space on printed circuit boards (PCBs). Embedded memories consume much of the floorplan in system-on-chip (SoC) devices. Many multi-die chip configurations, including 2.5D/3DIC devices, are driven by the need for faster memory access. Designing and verifying memo... » read more

Multi-Bit In-Memory Computing System for HDC using FeFETs, Achieving SW-Equivalent-Accuracies

By Technical Paper Link - 11 Nov, 2022 - Comments: 0

A new technical paper titled "Achieving software-equivalent accuracy for hyperdimensional computing with ferroelectric-based in-memory computing" by researchers at University of Notre Dame, Fraunhofer Institute for Photonic Microsystems, University of California Irvine, and Technische Universität Dresden. "We present a multi-bit IMC system for HDC using ferroelectric field-effect transistor... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 11 Nov, 2022 - Comments: 0

U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 11 Nov, 2022 - Comments: 0

Automotive And Mobility Two major auto OEMs revealed new electric vehicle models this week. The Audi Q8 e-tron has 40 driver assistance systems including five radar sensors, five cameras, and 12 ultrasonic sensors, and comes with either an 89 net kilowatt-hour battery or a 106 net kilowatt-hour battery. It arrives in the U.S. in April 2023. The Volvo EX90 contains both lidar and 5G connectivit... » read more

← Older posts Newer posts →