The Need For Traceability In Auto Chips
By Anne Meixner - 07 Apr, 2020 - Comments: 4

Someday your car will drive itself to a repair shop for a recall using a scheduling application that is both efficient and can prioritize which vehicles need to be fixed first. But that's still a ways off. Proactive identification of issues is not yet available. To be ready for that, today’s data analytics systems need to begin supporting targeted recalls, enabling predictive maintenance a... » read more

Service Agreements For Probe Systems
By Erik Hanson - 07 Apr, 2020 - Comments: 0

Having a Probe Systems Service Agreements can bring simplicity and peace of mind when it comes to keeping equipment operating at optimum performance. We take the guesswork out of maintenance budgeting by providing parts and labor coverage at a single, low cost. Priority service and part delivery eliminates time wasted waiting for maintenance or repair parts. Comprehensive, scheduled preve... » read more

Last-Level Cache
By Ed Sperling - 06 Apr, 2020 - Comments: 0

Kurt Shuler, vice president of marketing at Arteris IP, explains how to reduce latency and improve performance with last-level cache in order to avoid sending large amounts of data to external memory, and how to ensure quality of service on a chip by taking into account contention for resources. » read more

COVID-19 Tech Bits
By Linda Christensen - 06 Apr, 2020 - Comments: 0

Tech companies, consortiums and universities are jumping in to help fight COVID-19, deploying everything from massive computing capabilities to developing new technologies that can protect medical workers and first responders. Nearly all of these have ramped up over the past several weeks, as the tech world begins to take on a global challenge to combat the deadly virus. Compute resources... » read more

Manufacturing Bits: April 6
By Mark LaPedus - 06 Apr, 2020 - Comments: 0

Powerful electromagnets The National High Magnetic Field Laboratory (MagLab) has tested a new and powerful superconducting solenoid or electromagnet that operates at high currents. MagLab develops several different types of large and powerful magnets, which are used as scientific instruments. MagLab’s solenoid or electromagnet could one day be used to drive particle accelerators and compa... » read more

Power/Performance Bits: April 6
By Jesse Allen - 06 Apr, 2020 - Comments: 0

Durian supercapacitors Researchers from the University of Sydney developed a method that uses durian and jackfruit waste to create supercapacitors. Supercapacitors are capable of quickly storing and discharging energy. The team says their fruit-based material is more efficient than ones typically made from activated carbon. "Using durian and jackfruit purchased from a market, we conver... » read more

Holistic Yield Improvement Methodology
By PDF Solutions - 06 Apr, 2020 - Comments: 0

As new products and processes are being introduced into IC manufacturing at an accelerated rate, yield learning and ramping are becoming more challenging due to the increased interaction between the design and process. Compared to random defect caused yield losses, systematic yield loss mechanisms are becoming more important, thus initial yield ramping process becomes more challenging. A “hol... » read more

Cloudy With A Chance Of Better Analytics
By Optimal Plus - 06 Apr, 2020 - Comments: 0

How can you create product-oriented analytics on the factory floor while leveraging cloud capabilities at the same time? In our article, you will learn about: The importance of moving from machine analytics to product analytics. The benefits of migrating your analytics infrastructure to the cloud. How OptimalPlus successfully partnered with AWS to create an end-to-end analytics so... » read more

Case Study – Semiconductor Auto Multi Sensor
By CyberOptics - 06 Apr, 2020 - Comments: 0

CyberOptics’ WaferSense sensor, Auto Multi Sensor (AMS), combines an Auto Leveling Sensor (ALS), Auto Vibration Sensor (AVS), and a humidity sensor in a thin, light, all-in-one multi sensor. The ALS and AVS have well-established records of success for their ease-of-use, robust performance and convenient form factor. The addition of the humidity sensing (to tilt and vibration) in the AMS lets ... » read more

The Story Behind Advanced Packaging, Heterogeneous Integration and Test
By FormFactor - 06 Apr, 2020 - Comments: 0

The introduction of AMD’S FIJI chip a few years ago marked an important technology turning point for the semiconductor industry. This revolutionary graphics product delivered capability and innovation by relying on the first commercial example of 2.5D heterogenous integration, featuring a GPU assembled with High-Bandwidth-Memory (HBM) using Through-Silicon-Via (TSV) interconnect and interpose... » read more

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