category: Blogs – LPHP

category: Auto, Security & Edge AI

Preparing For 3DX
By Aveek Sarkar - 09 Aug, 2012 - Comments: 0

By Aveek Sarkar Undoubtedly we live in the age of mobility—smartphones, tablets, and ultra-books have transformed the way we work, live, and communicate. The worldwide smartphone market’s forecasted 24% CAGR, between 2010 and 2015 provides unique opportunities1. In emerging economies, more than 1 billion consumers are ready for the next new mobile platform2. Success in this market demands ... » read more

AMD’s Bobcat Processor
By Barry Pangrle - 09 Aug, 2012 - Comments: 0

Barry Pangrle The International Symposium on Low Power Electronics and Design (ISLPED) was held last week in Redondo Beach, California. There were many good presentations and keynote addresses and a topic that’s near to my heart, near-threshold voltage computing, was often discussed along with how best to (or not) handle variability. One paper out of many that caught my attention was The ... » read more

RTL Power Reduction Triathlon
By Atrenta - 09 Aug, 2012 - Comments: 0

Unless you’ve just come out of a week-long coma, you’ve been watching at least part of the Olympic Games in London. The years of training, the drama of competition, the thrill of victory… (you know the rest). Some contests come down to the smallest of margins to define who wins gold. The recent women’s triathlon is one such case. After a 500-meter swim, a 43-kilometer bike ride and a 10... » read more

Getting In the Ballpark
By Ann Mutschler - 09 Aug, 2012 - Comments: 0

I admit it; I still have DAC on the brain. Even though attendance may not have been what the exhibitors would have liked to see, the conference is always a fantastic place to discuss ideas and pick up on trends. One topic I discussed with a number of folks are the challenges associated with design today, from the power-performance balance, 3D stacking to new process nodes and complexity, to nam... » read more

Looking for a Sure Thing
By Atrenta - 08 Aug, 2012 - Comments: 0

By Mike Gianfagna Have you ever walked into a new car showroom and been told by the sales person that all cars were sold “as-is,” with no warranty? I doubt anyone would buy a car at a place like that. High-end cars can have more than 80 distinct electronic control systems on-board, each powered by various SoCs. And each of those SoCs contains many IP blocks sourced from multiple suppliers.... » read more

Stacking The Deck
By Matt Elmore - 12 Jul, 2012 - Comments: 0

By Matt Elmore Can we finally say that 3D-IC design has emerged from the realm of theory and research to actual commercial implementation? Xilinx recently announced initial shipments of its Virtex-7 H580T FPGA, described as “The world’s first 3D heterogeneous all programmable product.” The benefits of 3D implementation are many, as are its challenges. One of the hottest 3D-IC topics t... » read more

Power Mode And State
By Luke Lang - 12 Jul, 2012 - Comments: 0

By Luke Lang Low-power designs that use power shutoff (PSO) and multiple-supply voltage (MSV) will have circuits that operate at various voltages, including no voltage. To describe the combination of allowable voltages in a design, CPF uses power mode, and UPF 1.0 uses power state. In CPF, each power mode represents one combination of the states of all power domains. In UPF 1.0, each power ... » read more

Dealing With Variability
By Barry Pangrle - 12 Jul, 2012 - Comments: 0

By Barry Pangrle Process, voltage and temperature, a.k.a. PVT, are well known to designers who are working to complete “signoff” for their designs. In order for a design to be production-ready, it’s necessary to ensure that the design is going to yield parts at a sufficiently high percentage for profitability and that it will still operate within the expected variation of the process and... » read more

Bubble Gum and Scotch Tape
By Ann Mutschler - 12 Jul, 2012 - Comments: 0

It’s always extremely interesting to talk with actual design engineers, trudging through the trenches of challenges like 3D design. Recently, I was able to speak with Robert Patti, chief technology officer, vice president of design engineering and a director at Tezzaron Semiconductor. The company has been putting 3D designs together for quite some time so I expected to hear that they are u... » read more

New Reliability Issues
By Arvind Vel - 14 Jun, 2012 - Comments: 0

By Arvind Shanmugavel Reliability of ICs is a topic of growing concern with every technology node migration. With the onset of the 20nm process node from different foundries, reliability verification has taken center stage in design kits—and for good reason. Reliability margins have continued to decrease and have reached an inflection point at the 20nm node. The design and EDA communities ha... » read more

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