category: Blogs – LPHP

category: Auto, Security & Edge AI

Arm A-Profile Architecture Developments 2023
By Martin Weidmann - 12 Oct, 2023 - Comments: 0

As computing demands continue to evolve with the rise of artificial intelligence (AI) and advancing security threats, it is imperative that the foundational computing architecture at the heart of the world’s devices continues to evolve. This is why our engineering teams add new features and technologies to the pervasive Arm architecture, with the software teams then ensuring that software lan... » read more

Does Your NPU Vendor Cheat On Benchmarks?
By Steve Roddy - 12 Oct, 2023 - Comments: 0

It is common industry practice for companies seeking to purchase semiconductor IP to begin the search by sending prospective vendors a list of questions, typically called an RFI (Request for Information) or simply a Vendor Spreadsheet. These spreadsheets contain a wide gamut of requested information ranging from background on the vendor’s financial status, leadership team, IP design practices... » read more

Wireless Technology Insights: Navigating The Evolution From 5G To 6G
By Gabrielle Duncan - 12 Oct, 2023 - Comments: 0

As 5G evolution advances, developments like the open radio access network (O-RAN) ecosystem, non-terrestrial network (NTN) infrastructure, and 5G reduced capability (RedCap) devices continue to gain momentum. Though 5G implementation is still underway, the wireless communication industry is already preparing for next-generation 6G wireless technology. With so much development happeni... » read more

Do You Really Understand The Importance Of Parasitic Extraction In Chip Designs?
By Karen Chow - 12 Oct, 2023 - Comments: 0

By Susanne Lachenmann and Petya Aleksandrova, Infineon Technologies, and Karen Chow, Siemens EDA One of the biggest challenges integrated circuit (IC) designers face in today’s complex designs is effectively managing the effects of parasitic elements such as resistance, capacitance, and inductance. Parasitic elements can significantly impact chip performance of a chip, making it critical f... » read more

Automating Antenna Placement Workflow With PyAEDT
By Pete Gasperini - 12 Oct, 2023 - Comments: 0

Antenna designs can reach daunting levels of complexity, and nowhere is that truer than in advanced 5G and 6G systems. One of the most difficult problems in this design space is signal degradation stemming from electromagnetic (EM) interaction between the phased array antenna and the host structure itself, such as a base station or satellites. It is a pernicious issue that takes several advance... » read more

Understand The Physics Of Re-Entry Vehicles Using Numerical Modeling And Simulation
By Veena Parthan - 12 Oct, 2023 - Comments: 0

In the early years of space exploration, scientists and engineers dreamed of sending vehicles to Mars that could land on the planet's surface and explore its terrain. However, one of their biggest challenges was safely reentering the Martian atmosphere. Many early attempts at Mars missions failed because the vehicles either burned up during re-entry or crashed onto the surface. However, as tech... » read more

Reliability On The Rise In IC Design
By Andre Lange - 14 Sep, 2023 - Comments: 0

Reliability has been an important factor in the semiconductor industry for decades. A closer look reveals three main priorities: In the area of technology development and optimization, the microscopic mechanisms that lead to degradation must be identified and understood before they can be fixed. Microanalytical methods are used here as well as TCAD simulations. If it’s not possible to... » read more

Using Virtual Metal Fill To Predict The Impact Of High Level Nets
By Vamsi Thatha - 14 Sep, 2023 - Comments: 0

A recent blog post discussed the use of virtual metal fill (VMF) to predict the effects of real metal fill when performing RC extraction on a chip layout. This enables static timing analysis (STA) closely correlated with final post-fill results without incurring the time to perform the actual metal fill insertion during the layout-STA loop. VMF is fast enough to be run in every iteration of thi... » read more

No Hot Products
By Mike Donnelly - 14 Sep, 2023 - Comments: 0

While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component manufacturers and their OEM customers increasingly battle thermal design issues. Analog electronic component manufacturers have traditionally provided models in SPICE format so customers can sim... » read more

Unlocking Efficiency: The Power Of IP Blocks In Silicon Chip Design
By Amit Varde - 14 Sep, 2023 - Comments: 0

The fastest, most efficient and cost-effective way to design silicon is by leveraging intellectual property (IP) blocks. This methodology reduces risk, allows a design team to focus on its own differentiation, and allows scalability. Re-using existing IP offers even more value for design teams. But not every company has embraced the approach. Here’s why you should consider it. To optimize ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy