category: Blogs – LPHP

category: Auto, Security & Edge AI

Bridging The Digital Divide With Ultra Low-Cost Smartphones
By Neil Fletcher - 08 Dec, 2022 - Comments: 0

According to the Alliance for Affordable Internet, 2.5 billion people in emerging economies now have access to mobile broadband coverage, but many still cannot afford the typical smartphone. They need a device that hits the right price point, and also provides the right capabilities to support and enhance them in their daily lives. Despite greater connectivity, hitting this ‘smartphone sweet... » read more

Ensuring Signal And Power Integrity In Today’s High-Speed Designs
By Pavani Jella - 08 Dec, 2022 - Comments: 0

Leading-edge chip desiLeading-edge chip design was never easy, but it’s getting harder all the time. Rapid advances in communication systems are driving data rates higher. With the emergence of artificial intelligence (AI) applications and the increased need for data processing, high quality data transfer is increasingly critical. Faster data rates and more complex protocols are exacerbating ... » read more

Advanced Auto-Routing For TSMC InFO Technologies
By Paul McLellan - 08 Dec, 2022 - Comments: 0

At the recent TSMC OIP Symposium, John Park presented 'Advanced Auto-Routing for TSMC InFO Technologies.' InFO stands for "integrated fanout" and is the lower performance, lower complexity technology for advanced packaging. For details of TSMC's whole packaging portfolio, see my post TSMC OIP: 3DFabric Alliance and 3Dblox. Here's the slide TSMC presented from that presentation on InFO. As you... » read more

Making Electric Vehicles Go Further With New Materials
By Scott Wilkins - 08 Dec, 2022 - Comments: 0

It’s no secret that vehicle original equipment manufacturers (OEMs) are aggressively pursuing electric vehicle (EV) development. Among the headwinds they face in selling their technology to consumers are price and vehicle range. Not surprisingly, there is a direct correlation between the two — in 2021, for any EV under $40,000, the average vehicle range was 187 miles, while the lowest veh... » read more

The Computational Electromagnetics Simulation Challenge Of 3D-IC
By Kelly Damalou - 29 Nov, 2022 - Comments: 0

By Kelly Damalou and Matt Commens Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced the state of the art beyond SoC technologies which first united digital, analog, and memory functions on a single chip in the '90s. These ... » read more

Challenges And Solutions In Chip Design
By Marc Swinnen - 21 Nov, 2022 - Comments: 0

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

Predictive Health Monitoring In Functional Safety
By Jens Michael Warmuth - 10 Nov, 2022 - Comments: 0

Functional safety first became a major issue for the semiconductor industry in 2011 with the introduction of the ISO 26262 standard for implementing functional safety in the automotive industry. Before that, functional safety had already been standardized in a general manner for all industries since the end of the 1990s in IEC 61508. However, in the field of industrial automation, where the IEC... » read more

Accelerating IoT Designs: Designing For Low Power In The Era Of Smart Everything
By Ron Lowman - 10 Nov, 2022 - Comments: 0

Most of us have become accustomed to interacting with the ubiquitous technology ecosystem daily (if not hourly). From fitness trackers, smart vacuums, and semi-autonomous vehicles to the smart home devices that wake us up every morning, there’s no denying that the internet of things (IoT) boom has proliferated in every aspect of our lives. At the core of this instant, at-our-fingertips conn... » read more

Are You Paying Proper Attention To Your ESD Design Windows?
By Derong Yan - 10 Nov, 2022 - Comments: 0

Electrostatic discharge (ESD) issues in integrated circuit (IC) chip designs have become more critical at advanced semiconductor process nodes, due to shrinking transistor dimensions and oxide layer thickness [1]. There are many ESD design rules and flows that designers check for common ESD issues, such as topological checks for the existence of ESD protection devices, current density (CD) chec... » read more

GDDR6 Memory Enables High-Performance AI/ML Inference
By Frank Ferro - 10 Nov, 2022 - Comments: 0

A rapid rise in the size and sophistication of inference models has necessitated increasingly powerful hardware deployed at the network edge and in endpoint devices. To keep these inference processors and accelerators fed with data requires a state-of-the-art memory that delivers extremely high bandwidth. This blog will explore how GDDR6 supports the memory and performance requirements of artif... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy