category: Blogs – LPHP

category: Auto, Security & Edge AI

Ready, Set, Go: Outrunning Moore’s Law With 3D-IC
By Tony Mastroianni - 08 Dec, 2022 - Comments: 0

By Anthony Mastroianni and Gordon Allan, Siemens EDA 3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization efforts and supporting tool developments begin to make 3D IC practicable and profitable to more players – big and small – and products w... » read more

Edge AI And Chiplets
By Andy Heinig - 08 Dec, 2022 - Comments: 0

In the near future, more edge artificial intelligence (AI) solutions will find their way into our lives. This will be especially true in the private sector for applications in the field of voice input and analysis of camera data, which will become well-established. These application areas require powerful AI hardware to be able to process the corresponding continuously accumulating data volumes... » read more

Boosting Data Center Memory Performance In The Zettabyte Era With HBM3
By Frank Ferro - 08 Dec, 2022 - Comments: 0

We are living in the Zettabyte era, a term first coined by Cisco. Most of the world’s data has been created over the past few years and it is not set to slow down any time soon. Data has become not just big, but enormous! In fact, according to the IDC Global Datasphere 2022-2026 Forecast, the amount of data generated over the next 5 years will be at least 2x the amount of data generated over ... » read more

Don’t Let Your ML Accelerator Vendor Tell You The ‘F-Word’
By Steve Roddy - 08 Dec, 2022 - Comments: 0

Machine learning (ML) inference in devices is all the rage. Nearly every new system on chip (SoC) design start for mobile phones, tablets, smart security cameras, automotive applications, wireless systems, and more has a requirement for a hefty amount of ML capability on-chip. That has silicon design teams scrambling to find ML processing power to add to the existing menu of processing engines ... » read more

Bridging The Digital Divide With Ultra Low-Cost Smartphones
By Neil Fletcher - 08 Dec, 2022 - Comments: 0

According to the Alliance for Affordable Internet, 2.5 billion people in emerging economies now have access to mobile broadband coverage, but many still cannot afford the typical smartphone. They need a device that hits the right price point, and also provides the right capabilities to support and enhance them in their daily lives. Despite greater connectivity, hitting this ‘smartphone sweet... » read more

Ensuring Signal And Power Integrity In Today’s High-Speed Designs
By Pavani Jella - 08 Dec, 2022 - Comments: 0

Leading-edge chip desiLeading-edge chip design was never easy, but it’s getting harder all the time. Rapid advances in communication systems are driving data rates higher. With the emergence of artificial intelligence (AI) applications and the increased need for data processing, high quality data transfer is increasingly critical. Faster data rates and more complex protocols are exacerbating ... » read more

Advanced Auto-Routing For TSMC InFO Technologies
By Paul McLellan - 08 Dec, 2022 - Comments: 0

At the recent TSMC OIP Symposium, John Park presented 'Advanced Auto-Routing for TSMC InFO Technologies.' InFO stands for "integrated fanout" and is the lower performance, lower complexity technology for advanced packaging. For details of TSMC's whole packaging portfolio, see my post TSMC OIP: 3DFabric Alliance and 3Dblox. Here's the slide TSMC presented from that presentation on InFO. As you... » read more

Making Electric Vehicles Go Further With New Materials
By Scott Wilkins - 08 Dec, 2022 - Comments: 0

It’s no secret that vehicle original equipment manufacturers (OEMs) are aggressively pursuing electric vehicle (EV) development. Among the headwinds they face in selling their technology to consumers are price and vehicle range. Not surprisingly, there is a direct correlation between the two — in 2021, for any EV under $40,000, the average vehicle range was 187 miles, while the lowest veh... » read more

The Computational Electromagnetics Simulation Challenge Of 3D-IC
By Kelly Damalou - 29 Nov, 2022 - Comments: 0

By Kelly Damalou and Matt Commens Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced the state of the art beyond SoC technologies which first united digital, analog, and memory functions on a single chip in the '90s. These ... » read more

Challenges And Solutions In Chip Design
By Marc Swinnen - 21 Nov, 2022 - Comments: 0

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

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