category: Blogs – LPHP

category: Auto, Security & Edge AI

Predictive Health Monitoring In Functional Safety
By Jens Michael Warmuth - 10 Nov, 2022 - Comments: 0

Functional safety first became a major issue for the semiconductor industry in 2011 with the introduction of the ISO 26262 standard for implementing functional safety in the automotive industry. Before that, functional safety had already been standardized in a general manner for all industries since the end of the 1990s in IEC 61508. However, in the field of industrial automation, where the IEC... » read more

Accelerating IoT Designs: Designing For Low Power In The Era Of Smart Everything
By Ron Lowman - 10 Nov, 2022 - Comments: 0

Most of us have become accustomed to interacting with the ubiquitous technology ecosystem daily (if not hourly). From fitness trackers, smart vacuums, and semi-autonomous vehicles to the smart home devices that wake us up every morning, there’s no denying that the internet of things (IoT) boom has proliferated in every aspect of our lives. At the core of this instant, at-our-fingertips conn... » read more

Are You Paying Proper Attention To Your ESD Design Windows?
By Derong Yan - 10 Nov, 2022 - Comments: 0

Electrostatic discharge (ESD) issues in integrated circuit (IC) chip designs have become more critical at advanced semiconductor process nodes, due to shrinking transistor dimensions and oxide layer thickness [1]. There are many ESD design rules and flows that designers check for common ESD issues, such as topological checks for the existence of ESD protection devices, current density (CD) chec... » read more

GDDR6 Memory Enables High-Performance AI/ML Inference
By Frank Ferro - 10 Nov, 2022 - Comments: 0

A rapid rise in the size and sophistication of inference models has necessitated increasingly powerful hardware deployed at the network edge and in endpoint devices. To keep these inference processors and accelerators fed with data requires a state-of-the-art memory that delivers extremely high bandwidth. This blog will explore how GDDR6 supports the memory and performance requirements of artif... » read more

EDPS: Transitioning From 5G To 6G
By Paul McLellan - 10 Nov, 2022 - Comments: 0

At the recent EDPS, the keynote on the second day was by Mallik Tatipamula. He is the CTO of Ericsson Silicon Valley and also has experience all over the telecom industry with stints at F5, Juniper Networks, Cisco, Motorola, Nortel, and the Indian Institute of Technology Madras. Mallik started with a potted history of mobile. You may already know all this, and I've covered my version ... » read more

An Update On 5G And Aircraft Safety
By Pete Gasperini - 10 Nov, 2022 - Comments: 0

The U.S. aircraft industry is in the final phases of adapting aircraft and airports to address concerns over potential 5G cellular signal interference of automated landing systems. The Federal Aviation Administration (FAA) has driven the process to determine the level of risk to aircraft and safeguard against problems for low-visibility approaches — such as during inclement weather — for ne... » read more

Developers Embrace Standards To Accelerate Growth Opportunities For The IoT
By Paul Williamson - 10 Nov, 2022 - Comments: 0

By the end of the decade, the potential economic value of the Internet of Things (IoT) is expected to reach $12.6 trillion (yes, that’s a ‘t,’ not a typo), according to a McKinsey study. To achieve the scale required to meet this opportunity, critical IoT standards are coming together to enable the frictionless deployment of secure endpoint-to-cloud solutions – and being embraced by th... » read more

What’s So Different About Interposer Signal Integrity?
By Kelly Damalou - 28 Oct, 2022 - Comments: 0

By Kelly Damalou and Pete Gasperini To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an impressive evolution over the last several decades. Their development encourages technological advancement in applications like high-performance computing, Artificial... » read more

Heterogeneous Integration Co-Design Won’t Be Easy
By Tom Beckley - 13 Oct, 2022 - Comments: 0

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless interaction between your analog and digital IC and package design teams. Heterogeneous integration is the use of advanced packaging technologies to combine smaller, discrete chiplets into one syste... » read more

The New Disruptive Force In High-End AIoT Markets
By Jack Melling - 13 Oct, 2022 - Comments: 0

MediaTek is known for its SoC solutions in the mobile and consumer device markets. In fact, the smartphone market is now producing the most advanced and performant SoC designs on the planet. MediaTek is a vital part of this innovation. Each year it produces a range of chipsets for the mobile market, like the flagship Dimensity 9000 which adopted Arm’s v9 CPU and Mali-GPU technologies to del... » read more

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