category: Blogs – LPHP

category: Auto, Security & Edge AI

The EV Era Has Begun: Here Are Five Things We Need For It To Succeed
By Chet Babla - 11 Mar, 2021 - Comments: 0

The EV era has officially begun. General Motors says it will eliminate gas and diesel cars and SUVs from its lineup by 2035 while Ford will go all electric in Europe by 2030. The UK issued plans for phasing out diesel and gas cars by 2035 and then moved it forward to 2030. Fleet customers such as UPS and Amazon are ordering zero emissions delivery vehicles by the thousands and investing in s... » read more

Controlling The Reliability Of Silicon Carbide-Based Devices
By Peter Friedrichs - 11 Mar, 2021 - Comments: 0

The development of wide bandgap silicon carbide (SiC) compound semiconductors has proved to be extremely beneficial for power conversion applications. Capable of switching at significantly higher frequencies, and with higher breakdown voltage characteristics, SiC power transistors are quickly becoming an attractive silicon alternative for high power density and/or high-efficiency power conver... » read more

An Integrated Approach To Power Domain And CDC Verification
By Kurt Takara - 11 Mar, 2021 - Comments: 0

Reducing power consumption is essential for both mobile and data center applications. Yet it is a challenge to lower power while minimally impacting performance. The solution has been to partition designs into multiple power domains which allow selectively reducing voltage levels or powering off partitions. Traditional low power verification validates only the functional correctness of power... » read more

Addressing IC Hyperconvergence Design Challenges
By Aveek Sarkar - 11 Mar, 2021 - Comments: 0

Recently in an article titled “A Renaissance for Semiconductors,” my colleague Michael Sanie highlighted some of the trends that are driving next-generation product development. He detailed how designs targeting new applications are innovating through a combination of advanced process node technologies and heterogeneous integration of stacked die/3D/2.5D systems. Additionally, advanced vert... » read more

Die-To-Die Chiplet Communication
By Paul McLellan - 11 Mar, 2021 - Comments: 0

At CadenceLIVE Americas 2020, one of the most viewed videos was by Samsung Foundry's Kevin Yee and Cadence's Tom Wong, titled "Let’s Talk About Chips (Chiplets), Baby…It’s All About D2D!" They went for this title because it reminded them of the lyrics of an '80s song...which they proceeded to sing. Process and packaging trends Tom led off with a look at the trends in semiconducto... » read more

HBM2E Raises The Bar For AI/ML Training
By Frank Ferro - 11 Mar, 2021 - Comments: 0

The largest AI/ML neural network training models now exceed an enormous 100 billion parameters. With the rate of growth over the last decade on a 10X annual pace, we’re headed to trillion parameter models in the not-too-distant future. Given the tremendous value that can be derived from AI/ML (it is mission critical to five of six of the top market cap companies in the world), there has been ... » read more

Design Support For A Green IoT
By Dirk Mayer - 11 Feb, 2021 - Comments: 0

By Dirk Mayer and Roland Jancke The Internet of Things (IoT) is growing rapidly all around the world. New devices are continually being added, all collecting a variety of data and transmitting them (often wirelessly) to edge devices, which in turn relay the data to the cloud for further processing. It is estimated that in a few years IoT devices will be responsible for over 20% of global ene... » read more

The Many Flavors Of UPF: Which Is Right For Your Design?
By Madhur Bhargava - 11 Feb, 2021 - Comments: 0

Energy efficient electronic systems require sophisticated power management architectures that present difficult low-power verification challenges. Accellera introduced the Unified Power Format (UPF) standard in 2007 to help engineers deal with these complex issues. To keep pace with the growing complexity of low-power designs, the UPF standard has itself continued to evolve through the relea... » read more

Modeling PCBs For Common Causes Of Failure
By Theresa Duncan - 11 Feb, 2021 - Comments: 0

By Theresa Duncan and Michael Blattau When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical tests to determine how and why electronics fail, however, a much faster and cost-effective solution is PCB modeling and simulation. When simulation is used i... » read more

CXL: Sorting Out The Interconnect Soup
By Tim Messegee - 11 Feb, 2021 - Comments: 0

In the webinar Hidden Signals: Memory and Interconnect Decisions for AI, IoT and 5G, Shane Rau of IDC and Rambus Fellow Steven Woo discussed how interconnects were a critical enabling technology for future computing platforms. One of the major complications was the “interconnect soup” of numerous and divergent interface protocols. The Compute Express Link (CXL) standard offers to sort out m... » read more

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