Moving Past “It Works” — Intelligent Optimization Is the Key to PCB Excellence


In the fast-evolving field of electronic systems design, engineers are under increasing pressure to deliver innovative, high-performance products within ever-shrinking development cycles. Traditional methods—relying on intuition, trial-and-error testing, and even basic simulation—struggle to keep pace with the growing complexity of modern systems. Nowhere is this more evident than in printe... » read more

Maximize Uptime And Improve TCO: RAS And Telemetry In HBM4 For Data Centers


As AI workloads scale and data center operations become increasingly complex, it is critical to keep the infrastructure up and running. Total Cost of Ownership (TCO) is a key metric that includes not only the upfront cost of hardware but also the ongoing expenses of power, cooling, maintenance, and—most importantly—downtime. A single memory failure in a hyperscale AI cluster can cascade int... » read more

UEC-CBFC: Credit-Based Flow Control For Next-Gen Ethernet In AI And HPC


For ages, Ethernet has been the backbone of networking — starting from simple web browsing to cloud computing, data centers, automobiles, and more. Ethernet has enabled countless innovations, and now, it's expanding to meet the demands of AI and HPC. As the world shifts toward these new technologies, new challenges are emerging. These include increased scale, higher bandwidth density, mult... » read more

Digital Engineering Transforms Chips For The Future


The semiconductor industry stands at a critical turning point. With global semiconductor sales exceeding $600 billion last year, the need for the industry to scale has never been more apparent. As AI applications drive unprecedented requirements for processing capabilities, chip designers are turning to advanced simulation technologies to enable the digital engineering workflows that will sup... » read more

Start Experimenting With Neural Super Sampling For Mobile Graphics


Mobile game developers around the world face increasing pressure to meet user expectations for sharper visuals, smoother gameplay, and longer battery life. Balancing these goals on constrained mobile devices often means making trade-offs. Traditional upscaling methods offer limited flexibility. Real-time AI rendering remains complex, power-hungry, or hardware dependent. Neural Super Sampling... » read more

Transformers At The Edge: Efficient LLM Deployment


Since the groundbreaking 2017 publication of “Attention Is All You Need,” the transformer architecture has fundamentally reshaped artificial intelligence research and development. This innovation laid the foundation for Large Language Models (LLMs) and Video Language Models (VLMs), fueling a wave of productization across the industry. A defining milestone was the public launch of ChatGPT in... » read more

Do We Have Enough Standards For An Open-Chiplet Ecosystem?


For some time now, the semiconductor industry has been discussing the development of an open chiplet ecosystem. The idea is that, rather than having monolithic systems on a chip, it should be possible to combine smaller, specialized chiplets in a modular way – ideally across different manufacturers. Doing so would promise great flexibility with much shorter development times, resulting in muc... » read more

RTL Signoff vs. Functional Signoff: What’s The Difference?


By Bradley Geden and Manoz Palaparthi In semiconductor design, “signoff” is often treated as a single milestone. In practice, however, it encompasses distinct verification phases with unique objectives. Functional signoff and RTL signoff represent two such phases. Both are essential, and each one is focused on different facets of correctness. While functional signoff verifies whether ... » read more

Scaling In The AI Era: The Role Of PCI Express 7.0 Switches In Next-Gen Data Centers


As artificial intelligence (AI) workloads continue to scale in complexity and volume, the infrastructure that supports them must evolve just as rapidly. At the heart of this transformation lies PCI Express 7.0 (PCIe 7.0), a next-generation interconnect standard that is redefining how data moves within high-performance computing (HPC) and AI-driven data centers. PCIe 7.0 doubles the raw bit r... » read more

That’s Not A DSP!


In the 1986 hit comedy movie "Crocodile Dundee," the title character – a rough and tumble Australian transported to the mean streets of New York City – is confronted by street thugs brandishing a switchblade knife who demand his wallet. In response he cooly smirks and pulls a knife out of his belt that is 10 times the size of the would-be assailants’ weapon and delivers the signature line... » read more

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