Software Is At Least As Important As Hardware For Inference Accelerators


In articles and conference presentations on Inference Accelerators, the focus is primarily on TOPS (frequency times number of MACs), a little bit on memory (DRAM interfaces and on chip SRAM), very little on interconnect (also very important, but that’s another story) and almost nothing on the software! Without software, the inference accelerator is a rock that does nothing. Software is wha... » read more

Signal Integrity Through The Years


Yesterday, I started to talk about how new technologies find their way over time into EDA tools in my post How Technologies Get into EDA. Let's look at signal integrity as an example. We used not to worry about signal integrity at all. The first time anything like that impinged on my consciousness was in the early 1980s when we realized that we needed to start to consider the inductance... » read more

Bigger, Faster, More Diverse And Expensive


Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to talk about the race toward AI everywhere, how splintering markets are affecting design, and why software is now such a critical component of hardware development. SE: We're seeing big advances in compute performance due to advanced packaging and heterogeneous architectures. Is that sustainable? de Ge... » read more

Push-Button FMEDAs for Automotive Safety


Automotive designs require functional safety analysis, typically accomplished using Failure Modes, Effects and Diagnostic Analysis (FMEDA), used to determine each safety goal’s diagnostic coverage. Writing an FMEDA is a highly tedious task, so we share a push-button solution for creating and automating the FMEDA process, giving engineers more time to focus on exploring design safety readiness... » read more

Ensuring Functional Safety In Design


Mohammed Abdelwahid (Ali), automotive logic test product manager at Mentor, a Siemens Business, discusses how to maximize coverage in the different ASIL standards for logic BiST, how to make testing more efficient, and what impact that has on area and test time. » read more

Startup Funding: January 2020


A dozen tech startup companies started 2020 with new funding, raising +$500 million between them. Three companies received an impressive amount of investment. Stanford spinout Skylo launched from stealth with $116M in total funding and a bold plan to connect IoT devices, particularly sensors in remote or difficult-to-access environments, with hubs that link them to a network of satellites. ... » read more

Securing Smart Connected Homes With OTP NVM IP


The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly storing and processing very sensitive and private user data in addition to attempting to deliver copyright protected content from service providers. Pr... » read more

Differential Power Analysis


Authors Paul Kocher, Joshua Jaffe, and Benjamin Jun Cryptosystem designers frequently assume that secrets will be manipulated in closed, reliable computing environments. Unfortunately, actual computers and microchips leak information about the operations they process. This paper examines specific methods for analyzing power consumption measurements to and secret keys from tamper resistant d... » read more

Unprotected IoT Devices Threaten Consumer Privacy And Safety


Unprotected IoT devices continue to pose a disturbing threat to both consumer privacy and security. For example, a camera installed in the Memphis bedroom of a young girl was recently hijacked by a hacker who seized control of the device to spy on the 8-year-old, taunt her with music and encourage destructive behavior. Another infamous instance of a camera falling victim to a hacker was reporte... » read more

Week In Review: Auto, Security, Pervasive Computing


AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

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