Race to 448 Gbps


The relentless growth in data center and AI workloads is accelerating the need for faster, more efficient interconnect technologies. As applications like large language models and distributed training infrastructures push the limits of bandwidth, 400/800G Ethernet is quickly becoming a bottleneck. To support next-generation performance at 1.6T and 3.2T system levels, engineers must enable relia... » read more

Combining SPICE With IBIS-AMI: Solving Advanced Signal Integrity Verification Challenges With Solido SPICE


This paper explores current technology trends in high-speed links, including high-speed memory and SerDes applications, highlighting the critical roles of combined SPICE-level and IBIS-AMI modeling for accurate verification. Verifying high-speed links with IBIS-AMI during the circuit design phase presents significant complexity due to the combined effects of equalization schemes, channel S-para... » read more

Why Anti-Tamper Sensors Matter: Delivering A Comprehensive Security Solution


If your device processes valuable data, controls a critical function, or connects to a wider network, it’s a target. Attackers don’t just try to break software; they increasingly physically tamper with hardware: probing, fault injecting, or opening enclosures to bypass protections and extract secrets. The consequences range from IP theft and fraud to orchestrated downtime across fleets ... » read more

A Hybrid Subsystem Architecture To Elevate Edge AI


The world of artificial intelligence is moving beyond the cloud and into our everyday devices from smart sensors to robotics and AR/VR headsets. One of the key components that enables this shift is a neural processing unit (NPU), also known as an AI accelerator, which is a specialized hardware designed to execute AI models. Optimized for neural network, deep learning, and machine learning tasks... » read more

The Rise Of Scalable AI SoCs For The IoT Device Edge


The landscape of computing is undergoing a profound transformation, with Artificial Intelligence (AI) at its forefront. This shift is particularly evident at the device edge, where traditional System-on-Chip (SoCs) implementations are being reimagined to effectively support demanding AI and machine learning (ML) workloads. This evolution necessitates the development of a new class of AI-capa... » read more

Unearthing Hidden Reliability Risks


Successful automotive electronic design requires a focus on safety, performance and customer satisfaction. This makes IC reliability not just a “nice to have” feature, but a fundamental requirement. From advanced driver-assistance systems (ADAS) to infotainment and powertrain controls, every IC must work with exceptional reliability, even in tough conditions. Imagine a tiny circuit flaw in ... » read more

The Competitive Advantage Of SRAM PUF Technology


By Vincent van der Leest and Geert-Jan Schrijen In the article from 2024, "SRAM PUF: The Secure Silicon Fingerprint", we explored the fundamentals of SRAM-based Physical Unclonable Functions (PUFs) and their role as a secure, cost-effective, and scalable solution for cryptographic (root) key generation and storage. SRAM PUF technology leverages the unique physical properties of silicon to c... » read more

Location Verification Becomes Much Bigger Concern For Chips


Location verification is gaining traction as a way of strengthening supply chain oversight with minimal effort, fueled by tightening export controls and growing concerns about AI chip smuggling and counterfeiting. In the past, this kind of tracking was done by having one or more employees literally watch over a production run at a fab, follow the chips all the way to their destination, and a... » read more

How The Cyber Resilience Act Shifts Open-Source Responsibility To Vendors


The EU Cyber Resilience Act (CRA), adopted last year, aims to strengthen product security in several ways. One of its most ambitious goals is the elimination of exploitable vulnerabilities from digital products. Vendors are now obligated to identify vulnerabilities, resolve them before delivery, and continue addressing them throughout the product’s lifecycle. The scale of the challenge The ... » read more

Raising The Bar In Mission-Critical Verification


The 2024 Siemens EDA and Wilson Research Group Functional Verification Study provides an in-depth analysis of current trends in FPGA design and verification, with a particular focus on the aerospace and defense (A&D) sector. The study highlights the increasing complexity of FPGA designs driven by factors such as embedded processors, asynchronous clock domains, and stringent security and saf... » read more

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