category: System-Level Design

category: Auto, Security & Edge AI

Important Changes Ahead
By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

The Week In Review: Design/IoT
By Ed Sperling - 09 Jan, 2015 - Comments: 0

IP Cadence rolled out a fourth-generation audio/voice DSP core for 32-bit DTS-X audio/voice processing, using multi-channel object-based audio. The technology allows for more textured 3D sound, while simplifying the steps for creating sound channels. Chips NXP rolled out a one-chip solution for smart car access, which combines passive keyless entry, an RF transmitter and an immobilizer. Th... » read more

Blog Review: Jan. 7
By Ed Sperling - 07 Jan, 2015 - Comments: 0

Ansys' Justin Nescott has extracted the top 5 engineering technology articles for 2014. Check out the turbocharged Dyson hand vac and the suspended animation trials. Mentor's J. VanDomelen looks at on-demand additive manufacturing on the International Space Station, otherwise known as 3D modeling and printing. It's a lot faster than waiting for a delivery. Cadence's Brian Fuller sits dow... » read more

System Bits: Jan. 6
By Ann Mutschler - 06 Jan, 2015 - Comments: 1

Quantum channel of light In experiments using ultracold atoms and laser light, ETH researchers have measured a stepwise change in conductivity as the atoms pass through tiny structures. This is the first time that this quantum effect has been observed for electrically neutral particles. [caption id="attachment_16993" align="alignnone" width="300"] A point contact through which neutral, ultr... » read more

Software-Driven Verification (Part 2)
By Brian Bailey - 05 Jan, 2015 - Comments: 0

[getkc id="10" comment="Functional Verification"] has been powered by tools that require hardware to look like the kinds of systems that were being designed two decades ago. Those limitations are putting chips at risk and a new approach to the problem is long overdue. Semiconductor Engineering sat down with Frank Schirrmeister, group director, product marketing for System Development Suite at [... » read more

Blog Review: Dec. 31
By Ed Sperling - 31 Dec, 2014 - Comments: 0

Mentor's J. VanDomelen zeroes in on the two most interesting discoveries from the Philae comet landing. So what was that "eerie cyclical clicking" sound? Synopsys' Ray Varghese digs into basic coherent transaction testing for AXI/ACE compliant interconnects. You might want to put on another pot of coffee. Cadence's Brian Fuller offers some deep insights into synthesis, verification and te... » read more

System Bits: Dec. 30
By Ann Mutschler - 30 Dec, 2014 - Comments: 0

3D printing merges plastics, active electronics Princeton researchers have embedded tiny light-emitting diodes into a standard contact lens, allowing the device to project beams of colored light as part of a project demonstrating 3-D printing techniques. And while the lens is not designed for actual use — it requires an external power supply — the device was created to demonstrate the a... » read more

Hybrid Verification: The Only Way Forward
By Brian Bailey - 29 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

System Bits: Dec. 23
By Ann Mutschler - 23 Dec, 2014 - Comments: 0

Mini particle accelerator Researchers at MIT who succeeded last year in creating a material that could trap light and stop it in its tracks have now developed a more fundamental understanding of the process. The new work — which they said could help explain some basic physical mechanisms — shows that this behavior is connected to a wide range of other seemingly unrelated phenomena. Ligh... » read more

Is The Stacked Die Ecosystem Stagnating?
By Ann Mutschler - 23 Dec, 2014 - Comments: 0

While the stacked die ecosystem in general is currently status quo, with not much happening in the past year, there is definitely work being done —albeit cautiously—on the design tools side of things. It would be easy to feel impatient that the design tools are not complete and available today for [getkc id="82" comment="2.5D"] and [getkc id="42" comment="3D IC"] implementation until hearin... » read more

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