System Bits: May 13


Bringing hyperbolic metamaterials closer to reality Purdue Researchers have taken a step toward practical applications for hyperbolic metamaterials, which are ultra-thin crystalline films that could bring optical advances for microscopes, quantum computers and high-performance solar cells. Optical metamaterials harness clouds of electrons called surface plasmons to manipulate and control li... » read more

The Week In Review: Design


Tools Ansys-Apache rolled out a new version of its power noise and reliability tool for finFET-based designs. Given the fact that dynamic power is going to be a massive headache at 14/16nm and beyond due to much greater density, this is a first step in dealing with it. This is just the beginning of a massive effort by EDA to retool for finFETs and the 2.5D/3D architectures. Synopsys rolled... » read more

Blog Review: May 7


What if your toothbrush could talk? Semico Research’s Michell Prunty looks at the crowd-funded connected toothbrush design. And what else can it do? Cadence’s Richard Goering attended the Electronic Design Process Symposium in Monterey and summed up the progress in ESL: Power is less of an issue (for the moment), emulation is cheaper, but there is still a dearth of expertise and standard... » read more

System Bits: May 6


Nonlinear optical resonance The drive to develop ultrasmall and ultrafast electronic devices using a single atomic layer of semiconductors, such as transition metal dichalcogenides, has received a significant boost. Researchers with Berkeley Lab have recorded the first observations of a strong nonlinear optical resonance along the edges of a single layer of molybdenum disulfide. The existence ... » read more

Executive Insight: Wally Rhines


Semiconductor Engineering sat down with Wally Rhines, chairman and CEO of Mentor Graphics, to discuss what is required for EDA to grow, key areas of opportunity for EDA growth and going against the grain. The interview is part of an ongoing series of in-depth interviews with top executives from all segments of the industry. SE: What keeps you awake at night? Rhines: Actually nothing keeps... » read more

The Week In Review: Design


Tools CEVA integrated Bluetooth processing into its DSP cores. In addition to audio and video and always-on capabilities, the company is pitching the combination as an all-in-one, ultra-low-power solution for the wearable electronics market. So how big is this market opportunity? IDC predicts the wearable computing market will grow from 19.2 million units this year to 112 million units in 2... » read more

Blog Review: April 30


Applied Materials’ Jeremy Read points to a looming problem for the Internet of Things—legacy fabs that will require software upgrades and advanced process control. Also needed: Sensors attached to thousands of machines for predictive maintenance. Foundries are now ready for production finFETs. Cadence's Richard Goering captures the buzz at last week’s TSMC Tech Symposium, where the ro... » read more

System Bits: April 29


Beyond graphene Researchers at The University of Manchester have shown how they can control the properties of stacks of 2D materials, opening up the potential for new, previously-unimagined electronic devices. The isolation of graphene at the University in 2004 led to the discovery of many other 2D crystals and while graphene has an unrivaled set of superlatives, these crystals cover a larg... » read more

The Week In Review: Design


M&A Cadence announced its intention to acquire Jasper Design Automation, adding formal technology to its roster of verification tools. The purchase price was about $146 million, the $170 million Cadence offered minus the $24 million in cash and equivalents on Jasper’s books. Tools Synopsys rolled out new LPDDR4 IP that offers up to 3.2 Gbps with low power consumption. The company is ... » read more

Follow The Investments


Where is design heading over the next few years. The best way to tell that is to find out where the development dollars are going, and foundries and tools always precede actual designs. The foundries are starting to spend money—lots of it—on finFETs and 28nm. And while they’re talking about 2.5D and 3D, the money isn’t going there just yet. In fact, there are two different processes ... » read more

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