What To Expect In 2012


By Ann Steffora Mutschler Looking at the biggest challenges for system-level design in 2012, model availability, IP integration and hardware/software co-design top everyone’s list. The integration of IP and enabling that from a system-level perspective is a significant challenge for the industry. Moreover, it will become even more significant as the market moves further down the Moore’s... » read more

Make Vs. Buy


By Ann Steffora Mutschler The confounding ‘make versus buy’ decision is understandably muddled by design complexity. Millions of gates, thousands of blocks, dozens of cores, plus software, packaging, and worries about physical effects don’t make this decision any easier. In some cases the process can be simplified by mandating that anything that doesn’t add differentiation really is... » read more

Content And Gaming Drive Design


By Pallab Chatterjee This year’s IEDM conference will feature a non-device topic for the luncheon keynote from Masaaki Tsuruta, CTO of Sony on Interactive Gaming. The takeaway: Even in the heavy R&D and physics-centric world of devices, building for the end application has now become one of the top priorities in driving specifications. Traditional compute systems were based on batch-... » read more

Managing IP In Complex Devices


By Ann Steffora Mutschler Whether it is a smartphone, tablet, video game with home networking feature or any other digital device, each contains multiple subsystems with a mixture of IP blocks from either in-house development or licensed from third parties. Managing the subsystems, let alone the individual IP blocks and the interplay between all of them, is not getting any easier. In fact, wit... » read more

Build It Faster


By Ed Sperling Hitting market windows with IC designs has always been a struggle, but the race to the finish line is becoming more critical—and much more difficult. The reason: Market windows themselves are shrinking. Products that used to stick around for years may now only last for months, replaced by newer versions that offer either better performance or lower power. In many cases, par... » read more

The Next SoCs


By Ed Sperling The number of changes that will hit the IC market over the next few years is almost staggering by any standard—past or present. In addition to the relentless pressure of Moore’s Law, there will be new materials, new structures, and new models for developing and packaging chips. System-Level Design asked executives from across the SoC ecosystem what will change, what’s d... » read more

Software Takes Control


By Pallab Chatterjee The idea that SoC and system design are a mix of hardware and software, in the form of both application software and firmware, has been in place for more than 60 years. But the emphasis is beginning to shift. The traditional approach has been to create the highest-performance circuit design, with some control options for flexibility, and then use this adaptable "platfor... » read more

Derivative Designs Demand Discipline


By Ann Steffora Mutschler By and large most designs today are derivatives, meaning they don’t start from a blank slate. And while that gives engineering teams a starting point, it also can make adding new IP blocks or changes to the design problematic, with the potential for increased routing and timing issues along with considerable pain to back-end engineers and delays in chip schedules. ... » read more

VIP: Behind The Velvet Rope


By Ann Steffora Mutschler Some years ago, as engineering teams began to incorporate more protocols into designs and as those protocols grew in sophistication and complexity in order to deliver additional performance, the verification task grew concurrently. At the same time, the design IP market was growing as complexity drove re-use of components, along with verification components—most com... » read more

Collaboration Grows


By Ed Sperling A series of recent announcements by the Big Three EDA vendors and their well-known partners from across the disaggregated SoC ecosystem is lending new credence to the impact of collaboration. While IDMs such as Apple, Intel, Samsung and IBM continue to blaze their own trail, developing in-house tools, methodologies, processes and chips, fabless companies working with foundrie... » read more

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