category: Top Stories

category: Auto, Security & Edge AI

3D Stacking: A Reality Check
By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ed Sperling The first 2.5D and 3D chips are expected to arrive next year, with the mainstream chip market expected to follow in 2013. While this trend already has seen its share of hype, stacked die—whether through a series of TSVs in true 3D or through an interposer layer in 2.5D—is as real as Moore’s Law. In fact, it’s a direct result of Moore’s Law. But unlike the progres... » read more

Solving Memory Subsystem Bottlenecks In 3D Stacks
By Ann Mutschler - 28 Jul, 2011 - Comments: 0

In today’s do-or-die market environment, many SOC makers strive to differentiate their product based upon the rate at which it performs processing. Closely coupled are power concerns that have led to dominance of a multi-core approach, while economic considerations have resulted in the dominance of the Unified Memory Architecture, where all the processors share access to external DRAM. Stacki... » read more

Bigger Pipes, New Priorities
By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ann Steffora Mutschler From the impact of stacking on memory subsystems to advances in computing architecture, Micron Technology is at the forefront in the memory industry. System-Level Design sat down to discuss challenges, as well as some possible solutions, that plague memory subsystem architects with Scott Graham, general manager for Micron’s Hybrid Memory Cube (HMC) and Joe Jeddeloh,... » read more

The Growing Need For A Systems Approach
By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Gabe Moretti Electronic computing systems have gone through an evolutionary cycle since the invention of the mainframe, and the process is continuing. Semiconductor technology, mostly based on CMOS fabrication methods, has enabled an increase in design complexity and device functionality that have revolutionized the world. But 20nm processes may be the last that obey Newtonian physics. T... » read more

Let The Mobile Games Begin
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Pallab Chatterjee Mobile devices today are optimized for low- to mid-bandwidth data transmission, which is sufficient for e-mail, batch downloads of applications and music, and playback of encoded/compressed streaming video. But in coming months they will add another feature—image capture and processing and advanced graphics processing. This adds a whole new wrinkle to mobile devices, ... » read more

Different Ways To Boost Yield
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ann Steffora Mutschler In the race to get products to market with shortening product cycles, steepening the ramp to yield is critical. The introductory phase of a product is the point at which margins are highest and market share can be most easily gained. This is no surprise to chipmakers. What is surprising is just how much more difficult it has become to achieve acceptable yield quick... » read more

IP Tagging Resurfaces
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ed Sperling System-Level Design sat down with Kathy Werner, IP strategy and business manager inside of Freescale’s Design Technology Organization, to discuss tagging of soft IP. What follows are excerpts of that conversation. SLD: How new is the concept of IP tagging? Werner: IP tagging has been around for a long time. VSI Alliance was one of the first standards organizations that l... » read more

SoC Design In 5 Years
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ed Sperling The semiconductor industry is used to looking at changes every couple of years, based upon the progression of Moore’s Law. But look out further, over the next five years when the most advanced process node is somewhere between 14nm and 16nm, and the job of designing and manufacturing an SoC will look very different. At the center of this change are three very significant tr... » read more

Virtual Prototyping Takes Off
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ann Steffora Mutschler Skyrocketing software development costs, which for years have been “somebody else’s problem,” are now firmly part of the SoC development teams list of headaches. That has made virtual prototyping far more popular, particularly at 40nm and beyond, where engineers are looking at this approach as a way of managing complexity, doing architectural exploration and eve... » read more

Who’s In Control?
By Ed Sperling - 26 May, 2011 - Comments: 0

By Ed Sperling A power shift is under way across the SoC world that ultimately determine who wins the business, who gets the biggest share and what technologies are ultimately used to get there. Complexity has reached a point where being able to pull the necessary pieces from a disaggregated supply chain is becoming much more difficult. That helps explain why all three of the major EDA comp... » read more

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