category: Top Stories

category: Auto, Security & Edge AI

Small Vs. Large Language Models
By Ed Sperling - 03 Nov, 2025 - Comments: 0

The proliferation of edge AI will require fundamental changes in language models and chip architectures to make inferencing and learning outside of AI data centers a viable option. The initial goal for small language models (SLMs) — roughly 10 billion parameters or less, compared to more than a trillion parameters in the biggest LLMs — was to leverage them exclusively for inferencing. In... » read more

Thermal, Mechanical, And Material Stresses Grow With Die Stacking
By Ann Mutschler - 30 Oct, 2025 - Comments: 0

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause problems at any point during its expected lifetime. This includes everything from workload-dependent thermal gradients to mechanical and electrical stress, which may become more pronounced over time wi... » read more

Even With AI Inroads, Human Chip Designers Still Essential
By Liz Allan - 30 Oct, 2025 - Comments: 0

The proliferation of AI tools seems perfectly matched to fill a talent shortage, but a closer look shows the skills do not entirely overlap. Certain parts of the EDA pipeline require human engineers, and it seems likely to stay that way for the foreseeable future. The dark art of analog design, the final word on safety-critical functional safety, high-level architectural decisions, product i... » read more

Advances In Formal Verification Technology
By Brian Bailey - 30 Oct, 2025 - Comments: 0

Experts at the table: Semiconductor Engineering sat down to discuss advances in formal verification tools and methodologies with Ashish Darbari, CEO for Axiomise; Jin Zhang, product management group director for the Verification Group at Cadence; Sean Safarpour, executive director for R&D at Synopsys; and Jeremy Levitt, principal engineer for Digital Verification Technology at Siemens EDA.... » read more

Ensuring Reliability Becomes Harder In Multi-Die Assemblies
By Gregory Haley - 29 Oct, 2025 - Comments: 0

Multi-die assemblies are bringing together a variety of materials and processes with distinctly different physical properties, creating significant challenges in manufacturing and packaging that can impact yield at time zero and reliability in the field. What passes electrical screening at the end of the line may look good on paper, but these devices can still fail once exposed to rapid and ... » read more

Digital Twins For Packaging: Bridging Design, Fab, Test, And Reliability
By Gregory Haley - 23 Oct, 2025 - Comments: 0

Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry views the technology. What once was mainly associated with design exploration now spans the manufacturing lifecycle. In packaging and assembly, digital twins are emerging as a way to connect design ... » read more

Powering Efficiency: AI Transforms IC Manufacturing As ICs Fuel AI
By Laura Peters - 23 Oct, 2025 - Comments: 0

The push to grow today’s $500 billion-plus semiconductor industry to $1 trillion in annual revenue is challenging every aspect of the broader supply chain to embrace AI. Artificial intelligence is transforming the way fabs are architected and run, how devices are manufactured, and how server farms are constructed going forward. At the same time, all of this is being enabled by advancements... » read more

Why In-Memory Computation Is So Important For Edge AI
By Katherine Derbyshire - 23 Oct, 2025 - Comments: 1

In popular media, “AI” usually means large language models running in expensive, power-hungry data centers. For many applications, though, smaller models running on local hardware are a much better fit. Autonomous vehicles need to respond in real-time, without data transmission delays. Medical and industrial applications often depend on sensitive data that cannot be shared with third par... » read more

Multiple Challenges Emerge With Physical AI System Design
By Ann Mutschler - 22 Oct, 2025 - Comments: 0

Physical AI holds the promise of making everything from robots to a slew of mobile edge devices much more interactive and useful, but it will significantly alter how systems are designed, verified, and monitored. Physical AI systems need to work both independently and together. They need the ability to make decisions quickly and locally, typically using much less power than other types of AI... » read more

Data Centers Boost Voltage For Higher Efficiency
By Bryon Moyer - 16 Oct, 2025 - Comments: 0

The power architecture used in HPC and AI data centers today is about to undergo a significant change in an effort to boost power efficiency. While voltages at the chip level will remain the same, the voltages leading to those chips will be kept higher for longer distances. This change has broad implications for DC-DC converters. The existing architecture brings AC to each rack, converts it ... » read more

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