category: Top Stories

category: Auto, Security & Edge AI

Emulation’s Winding Path To Success
By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ed Sperling Emulation was developed for verifying complex ICs when simulation was considered too slow. After more than a decade of very slow growth, however, sales have begun to ramp. There are several reasons for this shift. First, SoCs simply are becoming more complex, and the amount of verification that needs to be done to get a chip out the door can bring simulation to a crawl. Desig... » read more

Leveraging The Past
By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler It’s easy to forget that not every design today is targeted at 20nm, given the amount of focus put on the bleeding edge of technology. But in fact a large number of designs utilize the stability and reliability of older manufacturing nodes, as well as lower mask costs, by incorporating new design and verification techniques, with 2.5D designs being a prime example. ... » read more

The Trouble With Models
By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler Models and modeling concepts seem to be on the tip of every tongue these days. Once the promise of sparking true ESL design, the use of system-level models has settled into something more like enabling software development. There is also talk of leveraging models across the supply chain, but is this really possible yet? The concept of doing this incremental refinem... » read more

The Ins And Outs Of Directed Self-Assembly
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Mark LaPedus H.S. Phillip Wong, professor of electrical engineering at Stanford University and one of the leading experts on directed self-assembly (DSA) technology, sat down to discuss the future of this approach with Semiconductor Manufacturing & Design. With funding from the Semiconductor Research Corp. (SRC), Stanford is exploring contact-hole patterning and the design infrastructur... » read more

CNSE Readying NFX Fab for G450C, EUV Efforts
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By David Lammers Two key areas of the semiconductor industry’s future—the 450mm wafer transition and EUV lithography—are the focus of the new NFX (NanoFab Xtension) building now under construction at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. [caption id="attachment_6322" align="alignright" width="120" caption="Alain Kaloyeros"][/caption] T... » read more

Fallback Plans
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler With EUV lithography missing a few deadlines already, the semiconductor industry has begun to search for alternatives. None of these solutions is simple, of course, and it’s questionable whether they’re even economically viable. And even if EUV is ready for mass production by 14nm, there are new challenges that have to be dealt with—particularly in the space... » read more

Foundries Going Greener
By Ed Sperling - 26 Jun, 2012 - Comments: 0

The ongoing push towards green and energy-efficient systems is prompting the silicon foundries to jump on the bandwagon and devise their next-generation processes based on ultra-high voltage technology. For some time, several foundries have offered 1- and 0.5-micron, ultra-high voltage processes with ratings up to 800 volts. But seeking to get a jump for the next wave of designs, the special... » read more

Challenges Mount For Interconnect
By Mark LaPedus - 26 Jun, 2012 - Comments: 0

By Mark LaPedus There are a plethora of chip-manufacturing challenges for the 20nm node and beyond. When asked what are the top challenges facing leading-edge chip makers today, Gary Patton, vice president of the Semiconductor Research and Development Center at IBM, said it boils down to two major hurdles: lithography and the interconnect. The problems with lithography are well documented.... » read more

Fabless-Foundry Model Under Stress
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Mark LaPedus The semiconductor roadmap was once a smooth and straightforward path, but chipmakers face a bumpy and challenging ride as they migrate to the 20nm node and beyond. Among the challenges seen on the horizon are the advent of 3D stacking, 450mm fabs, new transistor architectures, multi-patterning, and the questionable availability of extreme ultraviolet (EUV) lithography. ... » read more

Reducing Circuitry To Reduce Power
By Ed Sperling - 14 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler Power is at the top of the list of concerns for design teams today. Consequently, engineers are constantly looking at new techniques and architectural approaches to lower and management the power and energy consumption of their devices. This has resulted in some incredible engineering feats, turning parts of a device on and off as needed, applying different volta... » read more

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