category: Top Stories

category: Auto, Security & Edge AI

How Long Will CAN Stick Around As Rival Networks Speed Up?
By Liz Allan - 29 Apr, 2026 - Comments: 0

Key Takeaways Automotive Ethernet is rapidly becoming the backbone of software-defined vehicles for higher bandwidth, scalability, and advanced features like TSN and security that legacy protocols cannot match. CAN, LIN, and other legacy networks will not disappear quickly because they are deeply embedded, low‑cost, and proven, but they are increasingly seen as inadequate for future A... » read more

When Semiconductor Materials Misbehave
By Gregory Haley - 27 Apr, 2026 - Comments: 0

Key Takeaways Material behavior in production depends on the process context that no development environment can fully replicate. In advanced packaging, the interactions that cross domain boundaries are increasingly where failures originate. The most accurate materials data is also the most commercially sensitive, leaving simulation models calibrated against generic inputs rather tha... » read more

Can Edge AI Keep Up?
By Ann Mutschler - 23 Apr, 2026 - Comments: 0

Key Takeaways: Model development is outpacing silicon design cycles, so edge AI architectures must prioritize adaptability. The required cadence for model updates is highly application-dependent and is closely tied to product lifetime and operational risk. Adaptability can conflict with power, performance, and area targets, so effective heterogeneous architectures and robust softwa... » read more

TSV Complexity Leads To Manufacturing Bottleneck
By Laura Peters - 22 Apr, 2026 - Comments: 1

Key Takeaways: Through-silicon vias are the biggest enabler of 3D chip stacking and chip-to-PCB connections through silicon interposers. The AI boom is causing HBM and advanced assembly shortages, straining the supply chain. Optimization around etch, fill and reveal help reduce TSV cost. Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside hig... » read more

Batteries Charge To The Edge
By Ed Sperling - 20 Apr, 2026 - Comments: 1

Long-awaited advances in battery chemistry and materials science are beginning to roll out, opening the door for higher capacity, faster charging, and much lower likelihood of thermal runaway. This is a high-stakes race, fueled by an insatiable demand for power everywhere from handheld devices to data centers. When Finland's Donut Lab claimed earlier this year that it had developed a solid-s... » read more

Panel-Level Packaging’s Second Wave Meets Engineering Reality
By Gregory Haley - 16 Apr, 2026 - Comments: 0

Key Takeaways Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down. Glass improves the warpage and dimensional stability problems of organic substrates but introduces a different class of failure modes that require materials solutions, not process adjustments. The central challenges of panel-level processing are m... » read more

Chiplet Standards Aim For Plug-n-Play
By Bryon Moyer - 16 Apr, 2026 - Comments: 0

Key Takeaways Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in progress. Existing work covers packaging, a system architecture, various design kits, a universal link layer, and updates to BoW. Today’s chiplets exist in silos. In a ... » read more

Silicon Photonics Lights The Way To More Efficient Data Centers
By Katherine Derbyshire - 16 Apr, 2026 - Comments: 0

Key Takeaways Photonic interconnects potentially increase bandwidth density while significantly reducing power consumption. AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of different materials, introducing process compatibility and thermal and mechanical stress issues. Integrated electro-optical I/O modules are th... » read more

AI Growing Impact On Chip Design And EDA Tools
By Ed Sperling - 15 Apr, 2026 - Comments: 0

Key Takeaways Many workflows in the data center are customer-specific, which is part of the reason there is so much interest in agentic AI-enabled tools. Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The makeup of design teams is changing as AI infiltrates more of the chip design process. Experts at the Ta... » read more

Startup Funding: Q1 2026
By Jesse Allen - 13 Apr, 2026 - Comments: 0

The new year started off with a bang for private semiconductor companies, with 18 garnering mega funding rounds exceeding $100 million, and two, Rapidus and Cerebras, reaching the $1 billion mark. Predictably, the vast majority of those are either designing chips primarily for AI inference workloads or attempting to overcome bandwidth limitations by improving interconnects from the chip level t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy