Using AWS Cloud Services For IC Library Characterization That Is Scalable, Secure, And Fast


Siemens’ AMS Verification team and Amazon Web Services (AWS) have collaborated to provide users with a scalable, secure and cost-effective cloud characterization flow that enables users to leverage cloud computing resources to accelerate library characterization, reduce compute resource bottlenecks, as well as improve characterization runtime predictability. To read more, click here. » read more

Powering The Edge: Driving Optimal Performance With Ethos-N77 Processor


Repurposing a CPU, GPU, or DSP is an easy way to add ML capabilities to an edge device. However, where responsiveness or power efficiency is critical, a dedicated Neural Processing Unit (NPU) may be the best solution. In this paper, we describe how the Arm Ethos-N77 NPU delivers optimal performance. Click here to read more. » read more

Optimizing Power Supply


Any electrical engineer knows providing power to your board is a key feature in PCB design. While most boards can be functional, their true quality shines when the perfect level of power to components is achieved. Building and designing better power supplies is the best way to ensure the end-product has full life-cycle potential. But how do we ensure we can convert a (potentially variable) i... » read more

Data Center Evolution: DDR5 DIMMs Advance Server Performance


Driven by a confluence of megatrends, global data traffic is increasing at an exponential rate. For example, 5G networks are enabling billions of AI-powered IoT devices untethered from wired networks. Nowhere is the impact of all this growth being felt more intensely than in data centers. Indeed, hyperscale data centers have become the critical hubs of the global data network. DDR5 DRAM will en... » read more

Turning Cars Into Mobile Devices: MIPI


Everyone remembers their first car – how you could go where you wanted to go, moving faster and going longer distances – you were mobile. Yes, our cars made us mobile, but today’s cars are becoming mobile devices themselves. More than a means of transportation, cars are evolving into complete mobile devices – connecting and connected to the internet, transportation grids, and to each ot... » read more

Automotive IC Production Wafer Test In A Zero-Defect World


By Amy Leong, FormFactor. Innovations in automotive semiconductor ICs post a high bar for wafer test. FormFactor’s Chief Marketing Officer, Amy Leong, provides insights into the challenges associated with automotive IC production wafer testing amid the requirement for zero-defects. Click here to continue reading. » read more

Metrology at Automated Test Equipment Manufacturers


New technologies require an efficient qualification infrastructure to determine and qualify technical specifications. Metrology is the science which determines the acknowledged specification setting process based on proven international standards. This paper describes metrology and its role and benefits in automated test equipment business. By Piotr Skwierawski and Ralf Haefner. Click her... » read more

Accelerating SoC Verification Closure With Unified Verification Management Solution


Functional verification of system-on-chip (SoC) designs requires best-in-class tools linked together in a unified solution in order to address exponential complexity challenges. There is no one-size-fits-all method for verification. Complex designs require a combination of virtual prototyping, static checks, formal analysis, simulation, emulation and FPGA prototyping. The execution of all the t... » read more

Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities


Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultrasonic Technology (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-... » read more

Tessent LogicBIST With Observation Scan Technology


Meeting the ISO 26262 requirements for high quality and long-term reliability mans implementing on-chip safety mechanisms with high defect coverage of IC logic. This paper describes Observation Scan Technology, a new new logic built-in-self-test (BIST) technology that improves logic BIST test quality and reduces in-system test time. Empirical results demonstrate 90% test coverage with up to 10X... » read more

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