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• Dr. Subhash L. Shinde , Booz Allen, Ex. Univ. of Notre Dame, Ex. Sandia National Labs., Ex. IBM. on The Race To Glass Substrates
• Amba Prasad on HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)
• sam on HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)
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• Marc Swinnen on Development Flows For Chiplets
• Warren Savage on Development Flows For Chiplets
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• Brian Bailey on Tape-Out Failures Are The Tip Of The Iceberg
• Purple music on Tape-Out Failures Are The Tip Of The Iceberg
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• Al on Tape-Out Failures Are The Tip Of The Iceberg
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• Jack G on 3D-IC For The Masses
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• Santanu on Rethinking Engineering Education In The U.S.
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• Theodore Wilson on Shift Left Is The Tip Of The Iceberg
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• A Duck on Batteries Look Beyond Lithium
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• Allan Cox on Big Changes Ahead For Analog Design
• S on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• AI Research Scientist on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
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• Gan Future on Week In Review: Design, Low Power
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• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
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• Henley on A Buyers Guide To An NPU
• Joe L on Chip Industry Week in Review
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• Lincoln B on Blog Review: Aug. 7
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• Jerome Poussin on Navigating the Metrology Maze For GAA FETs
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• AMA on Using Emulators For Power/Performance Tradeoffs
• Dr. Dev Gupta on Intel Vs. Samsung Vs. TSMC
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• Ron Lavallee on The Value Of Innovation
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• Daniel B on U.S. Proposes Restrictions On Tech Investments In China
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• Tarhib IT Limited on Glass Substrates Gain Foothold In Advanced Packages
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• SpeedRazor on Making Chips To Last Their Expected Lifetimes
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