Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.
Startup Funding: Q4 2024
AI chips and interconnects end year on high note; $3 billion for 75 companies.
Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
What’s Next For Through-Silicon Vias
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.
Interconnects Approach Tipping Point
The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.
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