Implementing High-Density-Advanced Packaging For OSATs And Foundries

Common tools emerge for the IC and packaging domains.

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HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying process optimized design-kits such as ADK’s and PDKs, OSATs, foundries, and their customers can achieve design, fabrication, and assembly predictability and package performance.

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