Simplify large-scale projects, reduce development costs, and accelerate time to market with SoC integration automation.
The development of large-scale semiconductors has never been a simple task, but with the development of ever more powerful computers, software environments, and verification models, the task of designing cutting-edge chips becomes far more manageable. However, now that many chips being developed are utilizing as many as 1000 IP cores, the challenges of correctly connecting these modules together are growing exponentially.
A suite of tools can reduce the time taken to route systems and assemble the platform from weeks to days. This white paper will explore engineers’ challenges, solutions that can help with them, and why such solutions will not only benefit engineering teams in the short run but eventually lead to faster technological deployment.
Read more here.
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