tag: 2.5D

Raise A Fence, Dig A Tunnel, Build A Bridge
By Ed Sperling - 17 Sep, 2015 - Comments: 0

There are three main options for chipmakers over the course of the next decade. Which option they choose depends upon their individual needs, talents, and how much and what kind of differentiation they believe will matter to them. The options roughly fall into three categories—fence, bridge or tunnel. The fence option Rather than changing anything, the entire ecosystem can stick to wha... » read more

SEMICON Taiwan’s Packaging Punch
By SEMI - 17 Sep, 2015 - Comments: 0

SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

New System Requirements Demand a Creatively Choreographed Ecosystem
By Jim Feldhan - 17 Sep, 2015 - Comments: 0

In the past, integrated circuits, packages and boards were all designed independently, and yet in most cases still managed to fit together with very few functional or technical problems. However, recent advances in chip performance have changed this process dramatically. New designs, processes and materials already have been seen in packaging as high-performance semiconductor chips need to c... » read more

New Options For Power
By Ed Sperling - 10 Sep, 2015 - Comments: 0

Chipmakers have been talking for years about the next big breakthrough in battery technology, low-power architectures and energy harvesting. So far, none of them has made their job any easier. Batteries empty out too quickly, and the technology for improving the amount of energy that can be stored don't improve fast enough—or safely enough when they do show big improvements—to make a big... » read more

Rethinking Differentiation
By Ed Sperling - 28 Aug, 2015 - Comments: 0

Differentiation is becoming more difficult, more time-consuming, and in some cases much more expensive for chipmakers. The traditional metrics of faster performance, lower power and less area/cost, which are leftovers from the PC era, no longer are a guarantee of success despite the fact that they are still baseline metrics for many designs. Even new metrics such as ecosystem completeness, w... » read more

Electronics Butterfly Effect
By Brian Bailey - 27 Aug, 2015 - Comments: 1

Everyone has heard of the butterfly effect where a small change in a non-linear system can result in large difference in an outcome. For the past 40 years, the electronics industry has approximated a linear system, fed primarily by Moore’s Law. The incremental changes available at each new process node have led us to make incremental changes and improvements in many aspects of the design, its... » read more

Advanced IC Packaging Biz Heats Up
By Mark LaPedus - 20 Aug, 2015 - Comments: 0

After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more

Interconnect Challenges Grow
By Mark LaPedus - 20 Aug, 2015 - Comments: 1

It’s becoming apparent that traditional chip scaling is slowing down. The 16nm/14nm logic node took longer than expected to unfold. And the 10nm node and beyond could suffer the same fate. So what’s the main cause? It’s hard to pinpoint the problem, although many blame the issues on lithography. But what could eventually hold up the scaling train, and undo Moore’s Law, is arguably t... » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

The Great Imbalance
By Ed Sperling - 23 Jul, 2015 - Comments: 2

The number of options for chipmakers is growing while the number of chipmakers is shrinking. So what does this mean for the semiconductor industry? Short answer: No one is quite sure yet. But a lot more people are beginning to ask that question these days, including investors and analysts. There are a number of factors at play here. To begin with, there are more nodes to choose from than at ... » read more

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